Title:
SEMICONDUCTOR MODULE AND POWER CONVERTER USING SAME
Document Type and Number:
WIPO Patent Application WO/2015/162712
Kind Code:
A1
Abstract:
In order to suppress parasitic inductance that increases in a main terminal connection portion between a semiconductor module and an external bus bar, secure a heat-dissipating path for the connection portion, and ensure easy handling when the semiconductor module is conveyed and assembled to an inverter device, this semiconductor module is characterized in that in a semiconductor module (0) with a plurality of built-in semiconductor switching elements, a high-potential-side power supply terminal (1T) of the semiconductor module (0) and a low-potential-side power supply terminal (2T) of the semiconductor module (0) are formed from surfaces facing each other within the semiconductor module (0). Further, this power converter is characterized by being configured to be provided with the abovementioned semiconductor module.
Inventors:
YUKUTAKE SEIGO (JP)
MASUDA TORU (JP)
MASUDA TORU (JP)
Application Number:
PCT/JP2014/061355
Publication Date:
October 29, 2015
Filing Date:
April 23, 2014
Export Citation:
Assignee:
HITACHI LTD (JP)
International Classes:
H01L23/04; H01L25/07; H01L25/18; H02M7/48
Foreign References:
| JP2014013826A | 2014-01-23 | |||
| JP2013215071A | 2013-10-17 | |||
| JP2006148098A | 2006-06-08 | |||
| JP2011135737A | 2011-07-07 | |||
| JP2003218554A | 2003-07-31 | |||
| JP2006294849A | 2006-10-26 | |||
| JP2010104135A | 2010-05-06 | |||
| JP2010056206A | 2010-03-11 |
Attorney, Agent or Firm:
INOUE Manabu et al. (JP)
Manabu Inoue (JP)
Manabu Inoue (JP)
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