Title:
SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2015/125507
Kind Code:
A1
Abstract:
A semiconductor module (2) is provided with high-potential wiring (300), output wiring (400), low-potential wiring (500), an upper arm switching element (110), an upper arm diode (120), a lower arm switching element (210), and a lower arm diode (220). The semiconductor module is formed such that the steady loss/switching loss ratio of the upper arm switching element (110) is less than the steady loss/switching loss ratio of the lower arm switching element (210). Furthermore, the semiconductor module is formed such that the steady loss/switching loss ratio of the upper arm diode (120) is less than the steady loss/switching loss ratio of the lower arm diode (220).
Inventors:
KAMEYAMA SATORU (JP)
Application Number:
PCT/JP2015/050291
Publication Date:
August 27, 2015
Filing Date:
January 07, 2015
Export Citation:
Assignee:
TOYOTA MOTOR CO LTD (JP)
KAMEYAMA SATORU (JP)
KAMEYAMA SATORU (JP)
International Classes:
H02M3/155; H01L21/336; H01L27/04; H01L29/739; H01L29/78; H01L29/861; H01L29/868
Foreign References:
| JP2002165439A | 2002-06-07 | |||
| JP2013038911A | 2013-02-21 | |||
| JP2008177203A | 2008-07-31 | |||
| JP2012227335A | 2012-11-15 | |||
| JP2011029600A | 2011-02-10 |
Attorney, Agent or Firm:
KAI-U PATENT LAW FIRM (JP)
Patent business corporation KAI-U Patent Law Firm (JP)
Patent business corporation KAI-U Patent Law Firm (JP)
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