Title:
SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2017/047345
Kind Code:
A1
Abstract:
This semiconductor module is provided with: a substrate (10) which includes an insulation layer (11) and on which connection parts (12, 13) connecting the front surface to the rear surface of the insulation layer (11) are formed; a first pattern (20) formed on the front surface of the substrate (10); a second pattern (30) formed on the rear surface of the substrate (10); a first semiconductor element (50, 70, 90) which is arranged on the front surface side of the substrate (10) and which includes a fist switching element (51, 71, 91) having a lateral structure; a second semiconductor element (60, 80, 100) which is arranged on the rear surface side of the substrate (10) and which includes a second switching element (61, 81, 101) having a lateral structure; and a capacitor (40). A path formed by the first pattern (20) and the first semiconductor element (50, 70, 90) and a path formed by the second pattern (30) and the second semiconductor element (60, 80, 100) are opposed to each other with the substrate (10) interposed therebetween, and allow current to flow therethrough in directions opposite to each other.
Inventors:
YAMAGUCHI AKIHIRO (JP)
Application Number:
PCT/JP2016/074729
Publication Date:
March 23, 2017
Filing Date:
August 25, 2016
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
H01L25/07; H01L25/18; H02M7/48
Foreign References:
| JP2004022844A | 2004-01-22 | |||
| JP2010251711A | 2010-11-04 | |||
| JP2010205960A | 2010-09-16 | |||
| JPH02168663A | 1990-06-28 | |||
| JPH07273276A | 1995-10-20 | |||
| JP2011205020A | 2011-10-13 | |||
| JP2008198750A | 2008-08-28 |
Attorney, Agent or Firm:
JIN Shunji (JP)
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