Title:
SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2019/053942
Kind Code:
A1
Abstract:
This semiconductor module is provided with a substrate, an auxiliary terminal component, and a main terminal component. A first component includes a first end located on the substrate side and a second end located on a side distant from the substrate. A second component includes a third end located on the substrate side and a fourth end located on a side distant from the substrate. At least either one of: a state in which, in a direction perpendicular to a main surface, the height of the first end is different from that of the third end; and a state in which, in the outer edge extension direction in a region, of the outer edges of the substrate, facing the first end and the third end, the distance between the first end and the third end is greater than the distance between the second end and the fourth end in a plan view, is realized.
Inventors:
OOMORI HIROTAKA (JP)
Application Number:
PCT/JP2018/018378
Publication Date:
March 21, 2019
Filing Date:
May 11, 2018
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01L25/07; H01L23/04; H01L23/48; H01L25/18; H02M7/48
Foreign References:
| JP2014138480A | 2014-07-28 | |||
| JP2009064852A | 2009-03-26 | |||
| JPH09232512A | 1997-09-05 | |||
| JP2006310377A | 2006-11-09 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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