Title:
SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2022/080063
Kind Code:
A1
Abstract:
This semiconductor module comprises a conductive substrate, a semiconductor element, a control terminal, and a sealing resin. The conductive substrate has a main surface and a rear surface separated from each other in a thickness direction. The semiconductor element is electrically bonded to the main surface and has a switching function. The control terminal is configured to control the semiconductor element. The sealing resin has a main resin surface and a rear resin surface, and covers the conductive substrate, the semiconductor element, and a part of the control terminal. The control terminal protrudes from the main resin surface and extends in the thickness direction.
Inventors:
TANIKAWA KOHEI (JP)
HAYASHI KENJI (JP)
FUKUDA RYOSUKE (JP)
HAYASHI KENJI (JP)
FUKUDA RYOSUKE (JP)
Application Number:
PCT/JP2021/033676
Publication Date:
April 21, 2022
Filing Date:
September 14, 2021
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L23/28; H01L25/07; H01L25/18
Domestic Patent References:
| WO2018047659A1 | 2018-03-15 |
Foreign References:
| JP2020072106A | 2020-05-07 | |||
| JP2008124522A | 2008-05-29 | |||
| JP2015053241A | 2015-03-19 | |||
| JP2014123618A | 2014-07-03 | |||
| JP2017108187A | 2017-06-15 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
Download PDF: