Title:
SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2023/037809
Kind Code:
A1
Abstract:
Provided is a semiconductor module comprising: a first switching element which is reverse conducting and is provided to one of an upper arm and a lower arm; a second switching element which is reverse conducting and is provided to the other one of the upper arm and the lower arm; a first passage member which is electrically connected to one of a gate electrode and an emitter electrode of the first switching element; and a second passage member which is electrically connected to the other one of the gate electrode and the emitter electrode of the first switching element. The first passage member is disposed in proximity to the second switching element compared to the second passage member. The current flowing to the first passage member flows antiparallel to a reverse recovery current of the arm to which the second switching element is provided.
More Like This:
Inventors:
NOGAWA HIROYUKI (JP)
Application Number:
PCT/JP2022/030235
Publication Date:
March 16, 2023
Filing Date:
August 08, 2022
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD (JP)
International Classes:
H01L23/12; H01L25/07; H01L25/18; H02M7/48
Domestic Patent References:
| WO2014122908A1 | 2014-08-14 |
Foreign References:
| JP2019162032A | 2019-09-19 |
Attorney, Agent or Firm:
RYUKA IP LAW FIRM (JP)
Download PDF: