Title:
SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2023/074501
Kind Code:
A1
Abstract:
The present invention provides a semiconductor module which is provided with: a circuit body that comprises a semiconductor element and a plurality of external terminals which are connected to the semiconductor element; a substrate that comprises a power wiring layer which is connected to the plurality of external terminals; an insulating filling member that covers the connection part between the plurality of external terminals and the power wiring layer; a cooler that has one surface on which the circuit body and the substrate are mounted; and a heat dissipation member that is arranged between the cooler and the substrate. The heat dissipation member forms, on the cooler, a frame part that surrounds the outer periphery of the region on which the circuit body is mounted; and the inner side of the frame part is filled with the filling member.
Inventors:
ARAKI TAKAHIRO (JP)
TOKUYAMA TAKESHI (JP)
AOYAGI SHIGEHISA (JP)
TOKUYAMA TAKESHI (JP)
AOYAGI SHIGEHISA (JP)
Application Number:
PCT/JP2022/038966
Publication Date:
May 04, 2023
Filing Date:
October 19, 2022
Export Citation:
Assignee:
HITACHI ASTEMO LTD (JP)
International Classes:
H01L23/29; H01L23/34; H02M7/48
Domestic Patent References:
| WO2020105556A1 | 2020-05-28 |
Foreign References:
| JP2003249599A | 2003-09-05 | |||
| JPH07312411A | 1995-11-28 | |||
| JP2013026296A | 2013-02-04 | |||
| JP2006186057A | 2006-07-13 |
Attorney, Agent or Firm:
SUNNEXT INTERNATIONAL PATENT OFFICE (JP)
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