Title:
SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2024/080042
Kind Code:
A1
Abstract:
The present invention prevents deformation of an insulating component that insulates a positive terminal and a negative terminal. This semiconductor module has a terminal structure (15a) that includes: a positive terminal (12a); a negative terminal (13a); and a first insulating component (14a) that is sandwiched between the positive terminal (12a) and the negative terminal (13a) and that includes a protruding part which protrudes from between the positive terminal (12a) and the negative terminal (13a). The semiconductor module further includes: a second insulating component (18) and a third insulating component (19) which sandwich the terminal structure (15a) vertically and cover the front surface and the rear surface of at least a portion of the protruding part; and a case integrally formed with the terminal structure (15a) which is sandwiched between the second insulating component (18) and the third insulating component (19).
Inventors:
KAMEDA ERI (JP)
Application Number:
PCT/JP2023/032471
Publication Date:
April 18, 2024
Filing Date:
September 06, 2023
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD (JP)
International Classes:
H01L25/07; H01L23/48; H01L25/18
Attorney, Agent or Firm:
FUSO INTERNATIONAL PATENT FIRM (JP)
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