SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE - SONY SEMICONDUCTOR SOLUTIONS CORP

Title:

SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE

Document Type and Number:

WIPO Patent Application WO/2024/057709

Kind Code:

A1

Abstract:

Provided is a semiconductor package which bonds a substrate to a support body by means of an adhesive, wherein the adhesive is suppressed from flowing out of the specified area.　The semiconductor package comprises a substrate, a semiconductor chip, a support body, and a first adhesive. In this semiconductor package, the semiconductor chip is placed on the substrate plane of the substrate and electrically connected to the substrate. In addition, in the semiconductor package, a portion of the first adhesive flows into a gap between the substrate plane and the semiconductor chip and bonds the substrate to the support body.

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Inventors:

KOYAMA TOSHIKI (JP)
MIYAKI HARUMI (JP)
KUMON SATOSHI (JP)

Application Number:

PCT/JP2023/026524

Publication Date:

March 21, 2024

Filing Date:

July 20, 2023

Export Citation:

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Assignee:

SONY SEMICONDUCTOR SOLUTIONS CORP (JP)

International Classes:

H01L23/12; H01L23/02; H01L27/146; H04N25/70

Domestic Patent References:

WO2021117585A1	2021-06-17
WO2022153671A1	2022-07-21
WO2011121756A1	2011-10-06
WO2009130958A1	2009-10-29

Foreign References:

JP2011159900A	2011-08-18
JP2010161140A	2010-07-22
JP2004327560A	2004-11-18
JP2012095177A	2012-05-17
JP2005142360A	2005-06-02

Attorney, Agent or Firm:

MARUSHIMA, Toshikazu (JP)

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