Title:
SEMICONDUCTOR PACKAGE INCLUDING BONDING WIRE COATED WITH OXIDE INSULATION, ELECTRONIC SYSTEM INCLUDING SAME, AND BATTERY MODULE INCLUDING SAME
Document Type and Number:
WIPO Patent Application WO/2022/164073
Kind Code:
A1
Abstract:
The present invention provides a semiconductor package including a bonding wire coated with oxide insulation, an electronic system including same, and a battery module including same. According to an embodiment of the present invention, the semiconductor package comprises: a substrate; a semiconductor chip mounted on the substrate; a bonding wire connecting the substrate and the semiconductor chip and including a metal core portion located on the inside and an oxide insulation coating portion coating the metal core portion; and first fragments made of the same material as the oxide insulation coating portion of the bonding wire and located at a first portion at which the substrate and the bonding wire are connected.
Inventors:
PARK SOO JAE (KR)
Application Number:
PCT/KR2022/000317
Publication Date:
August 04, 2022
Filing Date:
January 07, 2022
Export Citation:
Assignee:
PARK SOO JAE (KR)
International Classes:
H01L23/00; H01B1/02; H01B3/10; H01B7/00; H01B7/02
Foreign References:
| JPH0621135A | 1994-01-28 | |||
| KR100817076B1 | 2008-03-26 | |||
| JP2013118310A | 2013-06-13 | |||
| KR100867573B1 | 2008-11-10 | |||
| US20100212153A1 | 2010-08-26 | |||
| KR102323557B1 | 2021-11-08 |
Attorney, Agent or Firm:
KIM, Nam Sik et al. (KR)
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