Title:
SEMICONDUCTOR PACKAGE INCLUDING RESIN, AND ELECTRONIC DEVICE COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2023/239076
Kind Code:
A1
Abstract:
An electronic device according to an embodiment comprises: a printed circuit board including a first side and a second side perpendicular to the first side; a plurality of solder balls arranged on one surface of the printed circuit board to be spaced apart from the first side and the second side; an electronic component including at least one circuit and disposed on at least some of the plurality of solder balls; and a resin disposed along the first side and filling a part of the space arranged between the one surface of the printed circuit board and the electronic component, wherein the printed circuit board includes a blocking structure disposed between the plurality of solder balls and the first side and extending along the first side to space at least some of the plurality of solder balls and the resin apart from each other.
Inventors:
SONG CHAGYU (KR)
SEO HOYEON (KR)
RA JAEYEON (KR)
PARK KOOKJIN (KR)
PARK CHULWOO (KR)
SHIN DONGJUN (KR)
LEE JONGBUM (KR)
JIN GYEONGMIN (KR)
SEO HOYEON (KR)
RA JAEYEON (KR)
PARK KOOKJIN (KR)
PARK CHULWOO (KR)
SHIN DONGJUN (KR)
LEE JONGBUM (KR)
JIN GYEONGMIN (KR)
Application Number:
PCT/KR2023/006716
Publication Date:
December 14, 2023
Filing Date:
May 17, 2023
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H01L23/13; H01L21/56; H01L23/00; H01L23/31; H01L25/065; H05K1/11; H05K1/18; H05K3/34
Foreign References:
| JP2002314002A | 2002-10-25 | |||
| US5659203A | 1997-08-19 | |||
| JP2020149993A | 2020-09-17 | |||
| KR20200108889A | 2020-09-21 | |||
| KR20000000737U | 2000-01-15 |
Attorney, Agent or Firm:
KWANG AND JANG INTELLECTUAL PROPERTY LAW FIRM (KR)
Download PDF: