Title:
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/054002
Kind Code:
A1
Abstract:
The technical idea of the present invention provides a semiconductor package manufacturing method comprising: a step of separating a plurality of dies from each other in the horizontal direction and arranging same on a carrier; a first sawing step of sawing the carrier so as to separate same into sub-panels in which the plurality of dies are arranged; a step of testing the dies; and a second sawing step of sawing each die of the sub-panels so as to separate same into individual semiconductor packages, wherein the carrier includes: a plurality of first regions in which the dies are arranged; and a second region in which the dies are not arranged, and the first horizontal distance between the side of the carrier and the first region is less than the second horizontal distance between the first region and the first region.
Inventors:
SHIN HYUNG JIN (KR)
Application Number:
PCT/KR2023/013267
Publication Date:
March 14, 2024
Filing Date:
September 05, 2023
Export Citation:
Assignee:
NEPES LAWEH CORP (KR)
International Classes:
H01L21/78; H01L21/66; H01L21/683; H01L23/00
Foreign References:
| KR20220041769A | 2022-04-01 | |||
| KR20140079204A | 2014-06-26 | |||
| KR20210120914A | 2021-10-07 | |||
| US20190287873A1 | 2019-09-19 | |||
| US6365438B1 | 2002-04-02 |
Attorney, Agent or Firm:
HAW, Yong Noke (KR)
Download PDF: