Title:
SEMICONDUCTOR PACKAGE, METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND THERMALLY CONDUCTIVE COMPOSITION USED THEREFOR
Document Type and Number:
WIPO Patent Application WO/2020/189446
Kind Code:
A1
Abstract:
A semiconductor package of the present invention is provided with: a substrate; a semiconductor element provided on the substrate; and a heat spreader surrounding the periphery of the semiconductor element, wherein the semiconductor element and the heat spreader are bonded with a thermally conductive material having a particle connecting structure in which metal particles are formed through sintering by heat treatment.
Inventors:
WATABE NAOKI (JP)
TAKAMOTO MAKOTO (JP)
TAKAMOTO MAKOTO (JP)
Application Number:
PCT/JP2020/010573
Publication Date:
September 24, 2020
Filing Date:
March 11, 2020
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
C09J4/00; C09J11/04; C09J133/00; C09J163/00; H01L23/36; H01L23/373
Domestic Patent References:
| WO2019111778A1 | 2019-06-13 |
Foreign References:
| US20180323130A1 | 2018-11-08 | |||
| JP2018528998A | 2018-10-04 | |||
| JP2017019904A | 2017-01-26 | |||
| JP2017171844A | 2017-09-28 | |||
| JP2015185807A | 2015-10-22 | |||
| JP2017022033A | 2017-01-26 | |||
| US20180190566A1 | 2018-07-05 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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