Title:
SEMICONDUCTOR PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2017/175944
Kind Code:
A1
Abstract:
The present invention provides a semiconductor package substrate having a simple process, and an improved pattern accuracy and product reliability, and a manufacturing method therefor, the semiconductor package substrate comprising: a base substrate, made of a conductive material, having a first region in which a chip is mounted and which has a first groove or a first trench on one side thereof, and a second region, in contact with the first region, having a dummy groove or dummy trench on one side thereof; and a resin filled in the first groove or the first trench and the dummy groove or the dummy trench.
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Inventors:
BAE IN SEOB (KR)
KANG SUNG IL (KR)
KANG SUNG IL (KR)
Application Number:
PCT/KR2016/013053
Publication Date:
October 12, 2017
Filing Date:
November 14, 2016
Export Citation:
Assignee:
HAESUNG DS CO LTD (KR)
International Classes:
H01L23/00; H01L23/053; H01L23/13; H01L23/498; H01L23/538
Domestic Patent References:
| WO2011136417A1 | 2011-11-03 |
Foreign References:
| US20070020926A1 | 2007-01-25 | |||
| KR20120116825A | 2012-10-23 | |||
| KR20110124482A | 2011-11-17 | |||
| US20160014878A1 | 2016-01-14 |
Attorney, Agent or Firm:
Y.P.LEE, MOCK & PARTNERS (KR)
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