Title:
SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2023/229350
Kind Code:
A1
Abstract:
A semiconductor package according to an embodiment comprises: an insulating layer; a protective layer disposed on the insulating layer; a through-electrode passing through the insulating layer; and a bump part disposed on the through-electrode and passing through the protective layer, wherein: the bump part comprises a first portion connected to the through-electrode and a second portion disposed on the first portion and protruding above the protective layer; and the width of the first portion in the horizontal direction is the same as the width of the second portion in the horizontal direction.
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Inventors:
SEONG DAE HYEON (KR)
PARK SU JIN (KR)
KOH DONG HYUK (KR)
PARK SU JIN (KR)
KOH DONG HYUK (KR)
Application Number:
PCT/KR2023/007026
Publication Date:
November 30, 2023
Filing Date:
May 23, 2023
Export Citation:
Assignee:
LG INNOTEK CO LTD (KR)
International Classes:
H05K1/11; H01L23/00; H01L23/31; H01L23/498; H05K1/09; H05K3/18; H05K3/40
Foreign References:
| KR100832651B1 | 2008-05-27 | |||
| KR100714818B1 | 2007-05-04 | |||
| KR20110124993A | 2011-11-18 | |||
| KR20140029101A | 2014-03-10 | |||
| KR20090057888A | 2009-06-08 |
Attorney, Agent or Firm:
HAW, Yong Noke (KR)
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