Title:
SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2023/239172
Kind Code:
A1
Abstract:
A semiconductor package, according to an embodiment, comprises: an insulating layer; a pad unit arranged on the insulating layer; and a protective layer arranged on the insulating layer and including an open region overlapping the pad unit in a vertical direction, wherein a horizontal width of the open region of the protective layer satisfies a range of 10 μm to 30 μm, and a surface roughness of a top surface of the protective layer is different from a surface roughness of an inner side surface of the open region of the protective layer.
Inventors:
LEE KEE HAN (KR)
KIM SANG IL (KR)
NA SE WOONG (KR)
KIM SANG IL (KR)
NA SE WOONG (KR)
Application Number:
PCT/KR2023/007849
Publication Date:
December 14, 2023
Filing Date:
June 08, 2023
Export Citation:
Assignee:
LG INNOTEK CO LTD (KR)
International Classes:
H05K3/28; H01L23/12; H01L23/31; H05K1/11
Foreign References:
| KR20210129410A | 2021-10-28 | |||
| KR20210121999A | 2021-10-08 | |||
| US20080217047A1 | 2008-09-11 | |||
| JP2009099597A | 2009-05-07 | |||
| KR20120067312A | 2012-06-25 |
Attorney, Agent or Firm:
HAW, Yong Noke (KR)
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