Title:
SEMICONDUCTOR PROCESSING ADHESIVE TAPE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/097420
Kind Code:
A1
Abstract:
[Problem] The purpose of the present invention is to provide a semiconductor processing adhesive tape that can suppress movement of a chip and can reduce chip cracking even when used in a DBG, particularly in a LDBG. [Solution] The semiconductor processing adhesive tape according to the present invention is characterized by having a base material and an adhesive layer provided on one surface of the base material, and is moreover characterized in that: the base material is formed from a single layer of resin film; and the product of the arithmetical average roughness Ra (units: nm) of the exposure surface of the resin film on the side opposite the adhesive layer, and the residual stress Rs (%) one minute after 10% stretching of the resin film, is 10,000 or less.
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Inventors:
TAMURA KAZUYUKI (JP)
Application Number:
PCT/JP2021/037348
Publication Date:
May 12, 2022
Filing Date:
October 08, 2021
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
H01L21/304; C09J7/38; H01L21/301; H01L21/67
Domestic Patent References:
| WO2017149926A1 | 2017-09-08 | |||
| WO2018066408A1 | 2018-04-12 | |||
| WO2017150676A1 | 2017-09-08 | |||
| WO2020003920A1 | 2020-01-02 |
Foreign References:
| JP2012209429A | 2012-10-25 | |||
| JP2007250789A | 2007-09-27 | |||
| JP2009239124A | 2009-10-15 |
Attorney, Agent or Firm:
MAEDA & SUZUKI (JP)
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