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Title:
SEMICONDUCTOR PROCESSING ADHESIVE TAPE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/201789
Kind Code:
A1
Abstract:
[Problem] To provide a semiconductor processing adhesive tape capable of suppressing the cracking of chips when peeling off the adhesive tape.　[Solution] A semiconductor processing adhesive tape having a base material and an adhesive layer, wherein, in a state in which one face of the adhesive layer is exposed to the atmosphere, after the adhesive tape is irradiated with ultraviolet light under the conditions of an illuminance of 220mW/cm2 and a light quantity of 500 mJ/cm3, the surface modulus of elasticity of the exposed face of the adhesive layer is 5 MPa or more.　

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Inventors:
IIZUKA RYO (JP)
MAEDA JUN (JP)
TAMURA KAZUYUKI (JP)
Application Number:
PCT/JP2022/001810
Publication Date:
September 29, 2022
Filing Date:
January 19, 2022
Export Citation:
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Assignee:
LINTEC CORP (JP)
International Classes:
C09J133/04; C09J7/38; H01L21/301; H01L21/304
Foreign References:
JP2018012751A2018-01-25
JP2015157931A2015-09-03
JP2018115332A2018-07-26
Attorney, Agent or Firm:
MAEDA & SUZUKI (JP)
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