SEMICONDUCTOR PROCESSING DEVICE AND METHOD - WUXI HUAYING MICROELECTRONICS TECH CO LTD

Title:

SEMICONDUCTOR PROCESSING DEVICE AND METHOD

Document Type and Number:

WIPO Patent Application WO/2017/088221

Kind Code:

A1

Abstract:

A semiconductor processing device, comprising: a first cavity chamber portion (110) and a second cavity chamber portion (120) capable of moving between an open position and a closed position with respect to the first cavity chamber portion (100). The first cavity chamber portion (110) has a groove channel (124) formed from a surface thereof to a recess of an inner wall surface (123) of a micro-cavity chamber, a first through-hole (125) communicating with a first position of the groove channel (124) and a second through-hole (126) communicating with a second position of the groove channel (124). When the second cavity chamber portion (120) is in the closed position relative to the first cavity chamber portion (110) and a semiconductor wafer (200) to be processed is accommodated in the micro-cavity chamber, a surface of the semiconductor wafer (200) abuts the inner wall surface (123) of the formed groove channel (124). At this time, the groove channel (124) utilizes blocking of the surface of the semiconductor wafer (200) to form a sealed channel, and the sealed channel is connected to the outside via the first through-hole (125) and the second through-hole (126). Thus, processing fluid flow direction and flow speed can be precisely controlled, greatly saving processing fluid.

Inventors:

WEN SOPHIA (CN)
WANG ZHIKAI (CN)

Application Number:

PCT/CN2015/098101

Publication Date:

June 01, 2017

Filing Date:

December 21, 2015

Export Citation:

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Assignee:

WUXI HUAYING MICROELECTRONICS TECH CO LTD (CN)

International Classes:

H01L21/02; H01L21/67

Foreign References:

US20140227866A1	2014-08-14
US20150099371A1	2015-04-09
CN104979237A	2015-10-14
CN201210171681A	2012-05-29
CN201210088237A	2012-03-29

Other References: