SEMICONDUCTOR PROCESSING SOLUTION

Title:

SEMICONDUCTOR PROCESSING SOLUTION

Document Type and Number:

WIPO Patent Application WO/2024/075704

Kind Code:

A1

Abstract:

Provided is a semiconductor processing solution that is used in the removal of a transition-metal-including substance on a substrate, the semiconductor processing solution including: at least one type of ion that is selected from the group consisting of a specific halogen oxyacid ion, a bromide ion, a bromous acid ion, a bromate ion, a chloride ion, a chlorate ion, an iodate ion, an iodide ion, and a triiodide ion; and at least one type of metal that is selected from the group consisting of Ca, Na, K, Cr, Ni, and Al, wherein the concentration of any one type of metal of Ca, Na, K, Cr, Ni, or Al is 0.1–200 ppt inclusive.

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Inventors:

SUZUKI YUZAN (JP)
KIKKAWA YUKI (JP)
SATO TOMOAKI (JP)

Application Number:

PCT/JP2023/035958

Publication Date:

April 11, 2024

Filing Date:

October 02, 2023

Export Citation:

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Assignee:

TOKUYAMA CORP (JP)

International Classes:

H01L21/308

Domestic Patent References:

WO2022030627A1	2022-02-10
WO2019150990A1	2019-08-08

Foreign References:

JP2022099242A

2022-07-04

Attorney, Agent or Firm:

IP FIRM SHUWA (JP)

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