SEMICONDUCTOR RESIN MATERIAL, MOLDED ARTICLE THEREOF, USE THEREOF, AND FLEXIBLE PRINTED MATERIAL

Title:

SEMICONDUCTOR RESIN MATERIAL, MOLDED ARTICLE THEREOF, USE THEREOF, AND FLEXIBLE PRINTED MATERIAL

Document Type and Number:

WIPO Patent Application WO/2023/120304

Kind Code:

A1

Abstract:

This semiconductor resin material comprises a polyimide resin (A) containing repeating structural units derived from an aromatic tetracarboxylic acid component and an aliphatic diamine component.

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Inventors:

SAKAI ATSUSHI (JP)
SATO YUUKI (JP)

Application Number:

PCT/JP2022/045855

Publication Date:

June 29, 2023

Filing Date:

December 13, 2022

Export Citation:

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Assignee:

MITSUBISHI GAS CHEMICAL CO (JP)

International Classes:

C08L79/08; C08G73/10; C08L101/00; H05B33/00; H05K1/03

Domestic Patent References:

WO2015020020A1	2015-02-12
WO2016147996A1	2016-09-22
WO2005092984A1	2005-10-06

Foreign References:

JP2020007464A	2020-01-16
JP2021534271A	2021-12-09

Attorney, Agent or Firm:

OHTANI PATENT OFFICE (JP)

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