Title:
SEMICONDUCTOR THIN FILM FORMING METHOD, PRODUCTION METHODS FOR SEMICONDUCTOR DEVICE AND ELECTROOPTICAL DEVICE, DEVICES USED FOR THESE METHODS, AND SEMICONDUCTOR DEVICE AND ELECTROOPTICAL DEVICE
Document Type and Number:
WIPO Patent Application WO/2002/047137
Kind Code:
A1
Abstract:
A method of forming a large-area, high-crystallinity, high quality, polycrystalline or single-crystal semiconductor thin film such as polycrystalline silicon, and a device for implementing this method. A method of forming a polycrystalline (or single-crystal) semiconductor thin film, or a method of fabricating a semiconductor device wherein, when forming on a substrate (1) a high-crystallinity, large-grain-size polycrystalline (or single-crystal) semiconductor thin film (7) such as a polycrystalline silicon film, or when fabricating a semiconductor device having a polycrystalline (or single-crystal) semiconductor thin film (7) on a substrate (1), after a low crystalline semiconductor thin film (7A) is formed on the substrate (1), a flash lamp anneal is applied to the thin film (7A), and the crystallization of the thin film (7A) is promoted by fusing, or semi-fusing, or heating and cooling in a non-fused condition to obtain the polycrystalline (or single-crystal) semiconductor thin film; and devices for implementing these methods.
Inventors:
YAMANAKA HIDEO (JP)
Application Number:
PCT/JP2001/010733
Publication Date:
June 13, 2002
Filing Date:
December 07, 2001
Export Citation:
Assignee:
SONY CORP (JP)
YAMANAKA HIDEO (JP)
YAMANAKA HIDEO (JP)
International Classes:
C23C16/24; C23C16/56; C30B13/24; H01L21/20; H01L21/336; H01L29/786; (IPC1-7): H01L21/20; H01L29/786; H01L31/04; H01L21/26; H01L21/205; G02F1/1368; G09F9/30; H01J9/02; H01J1/304
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JPS57183020A | 1982-11-11 | |||
JPS63278217A | 1988-11-15 | |||
JPH02283036A | 1990-11-20 | |||
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Attorney, Agent or Firm:
Nakamura, Tomoyuki c/o Miyoshi International Patent Office 9th Floor (Toranomon Daiichi Building 2-3 Toranomon
1-chome Minato-ku, Tokyo, JP)
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