Title:
SENSING SYSTEM FOR GRIP CONTROL, GRIPPING APPARATUS, ROBOT APPARATUS AND CONTROL METHOD FOR SAME
Document Type and Number:
WIPO Patent Application WO/2024/024377
Kind Code:
A1
Abstract:
There is provided an apparatus including: a hand portion with a plurality of finger portions respectively having gripping surfaces capable of gripping a work; a sensor unit provided in at least one of the plurality of finger portions and capable of detecting a pressure distribution on the gripping surface; and a control apparatus configured to detect a slip of the work on the gripping surface on the basis of an output of the sensor unit and generate a control command to change a relative position of the hand portion with respect to the work.
Inventors:
GOTO TETSURO (JP)
KOBAYASHI KEN (JP)
HASEGAWA HAYATO (JP)
SAKAKURA YOSHIAKI (JP)
MIYAWAKI MANAMI (JP)
TSUKAMOTO KEI (JP)
KOBAYASHI KEN (JP)
HASEGAWA HAYATO (JP)
SAKAKURA YOSHIAKI (JP)
MIYAWAKI MANAMI (JP)
TSUKAMOTO KEI (JP)
Application Number:
PCT/JP2023/023901
Publication Date:
February 01, 2024
Filing Date:
June 28, 2023
Export Citation:
Assignee:
SONY GROUP CORP (JP)
International Classes:
B25J13/08; B25J9/16; G01L1/14
Domestic Patent References:
| WO2021066122A1 | 2021-04-08 |
Foreign References:
| US20140148951A1 | 2014-05-29 | |||
| US8644986B2 | 2014-02-04 | |||
| JP2005177977A | 2005-07-07 | |||
| JP2019002905A | 2019-01-10 |
Attorney, Agent or Firm:
MINAMI AOYAMA PATENT AND TRADEMARK ATTORNEYS (JP)
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