Title:
SENSOR DEVICE, SENSOR CONTROL SYSTEM, AND CONTROL METHOD
Document Type and Number:
WIPO Patent Application WO/2023/181783
Kind Code:
A1
Abstract:
In regard to a sensor device serving as a laminated AI sensor, the present invention increases the processing efficiency of an AI processing unit to thereby enhance and speed up an AI processing function and improve the robustness of AI processing. A sensor device according to the present technology has a structure in which a first semiconductor layer including an image array unit in which a plurality of pixels each having a light-receiving element are two-dimensionally arranged, and a second semiconductor layer including an AI processing unit for performing an AI process using an AI model on a captured image obtained on the basis of light-receiving operation by the pixel array unit, are laminated. The sensor device also comprises a control unit for performing control for distributing the process executed by the AI processing unit between the sensor device and other sensor devices having a structure in which the first and second semiconductor layers are laminated.
Inventors:
TAKATSUKA SUSUMU (JP)
UENO HIROSHI (JP)
TETSUKAWA HIROKI (JP)
UENO HIROSHI (JP)
TETSUKAWA HIROKI (JP)
Application Number:
PCT/JP2023/006770
Publication Date:
September 28, 2023
Filing Date:
February 24, 2023
Export Citation:
Assignee:
SONY GROUP CORP (JP)
International Classes:
H04N23/54; H04N23/60
Domestic Patent References:
| WO2021177085A1 | 2021-09-10 |
Foreign References:
| JP2018207222A | 2018-12-27 | |||
| US20210409834A1 | 2021-12-30 | |||
| JP2014102691A | 2014-06-05 | |||
| JP2020177343A | 2020-10-29 |
Attorney, Agent or Firm:
TECHNOPEER PATENTS & TRADEMARKS (JP)
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