Title:
SENSOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/195265
Kind Code:
A1
Abstract:
The present invention provides a sensor device comprising: a semiconductor substrate including a wiring layer and provided with a first Cu electrode electrically connected to the wiring layer; an image sensor chip which is placed on the semiconductor substrate and in which a pixel array having photoelectric conversion elements arranged in an array form is formed; and a semiconductor integrated circuit chip placed on the semiconductor substrate in parallel with the image sensor chip. Each of the image sensor chip and the semiconductor integrated circuit chip is provided with a second electrode bonded to the first Cu electrode on a surface opposed to the semiconductor substrate. Further, the image sensor chip and the semiconductor integrated circuit chip are configured such that the heights of upper end surfaces thereof are aligned.
Inventors:
YAMADA KYOSUKE (JP)
Application Number:
PCT/JP2023/006902
Publication Date:
October 12, 2023
Filing Date:
February 27, 2023
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146
Domestic Patent References:
| WO2006129762A1 | 2006-12-07 | |||
| WO2020095544A1 | 2020-05-14 | |||
| WO2016143194A1 | 2016-09-15 |
Foreign References:
| JP2016171297A | 2016-09-23 | |||
| JP2004241495A | 2004-08-26 |
Attorney, Agent or Firm:
TANAKA Hidetetsu et al. (JP)
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