Title:
SENSOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/238791
Kind Code:
A1
Abstract:
Provided is a sensor device with a simple configuration. A sensor device (1, 100, 200) comprises: a shaft (S), a bearing (20) directly or indirectly disposed on the shaft (S); and a holder (10, 210) disposed on the bearing (20). The holder (10, 210) includes: an inner circumferential member (11); an outer circumferential member (12, 212); a connecting portion (13) that connects the inner circumferential member (11) and the outer circumferential member (12, 212); and a first strain sensor (16) disposed on the connecting portion (13). In the radial direction, the inner circumferential member (11) is disposed outside of the bearing (20), and the connecting portion (13) rotatably supports the inner circumferential member (11) relative to the outer circumferential member (12, 212).
Inventors:
MURAKAMI HIROAKI (JP)
KEBUKAWA KOUJI (JP)
KEBUKAWA KOUJI (JP)
Application Number:
PCT/JP2023/020630
Publication Date:
December 14, 2023
Filing Date:
June 02, 2023
Export Citation:
Assignee:
MINEBEA MITSUMI INC (JP)
International Classes:
G01L5/1627
Foreign References:
JPS4717484A | ||||
JP2013032916A | 2013-02-14 | |||
US20120285264A1 | 2012-11-15 |
Attorney, Agent or Firm:
EINSEL Felix-Reinhard et al. (JP)
Download PDF:
Previous Patent: RESIN COMPOSITION AND MOLDED ARTICLE
Next Patent: PHOTOCURABLE COMPOSITION AND METHOD FOR PRODUCING CAMERA MODULE
Next Patent: PHOTOCURABLE COMPOSITION AND METHOD FOR PRODUCING CAMERA MODULE