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Patent Searching and Data


Title:
SENSOR MODULE, MANUFACTURING METHOD THEREFOR, AND SENSOR SYSTEM
Document Type and Number:
WIPO Patent Application WO/2023/182134
Kind Code:
A1
Abstract:
The present invention resolves alignment between a lens unit and a mounting part for mounting the lens unit, and increases the freedom of selection and design with respect to the lens unit and the mounting part, through an alignment function of an attachment part.  A sensor module of the present disclosure comprises: a lens unit (4); a platform (6) on which is disposed a sensor (20) for receiving light from the lens unit; a mounting part (8) which is disposed on the platform; and an attachment part (10) for aligning the mounting part and the lens unit.

Inventors:
TAMAKI KATSUYA (JP)
HONDA IKUFUMI (JP)
SHIBATA NAOHISA (JP)
Application Number:
PCT/JP2023/010260
Publication Date:
September 28, 2023
Filing Date:
March 16, 2023
Export Citation:
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Assignee:
NIPPON CHEMICON (JP)
International Classes:
G02B7/02; G03B11/00; G03B17/02; G03B30/00; H04N23/57
Domestic Patent References:
WO2021200557A12021-10-07
Foreign References:
JP2005079892A2005-03-24
JPS56105970U1981-08-18
JP2003189195A2003-07-04
JP2005051524A2005-02-24
Attorney, Agent or Firm:
UNEMOTO Shoichi et al. (JP)
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