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Title:
SENSOR MODULE
Document Type and Number:
WIPO Patent Application WO/2022/149414
Kind Code:
A1
Abstract:
[Problem] To provide a sensor module that can suppress the generation of resin burrs and can improve workability. [Solution] This sensor module (100) comprises a sensor element, a first case (11), a second case (12), and a groove (70). The first case (11): has an opening end section including a first welding region; and houses the sensor element. The second case (12) has a bonding surface (123) that includes a second welding region (50) that, by being welded to the first welding region, forms a welded section. The groove (70) is formed in at least either the first welding region or the second welding region (50).

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Inventors:
TANAKA HARUKI (JP)
Application Number:
PCT/JP2021/046006
Publication Date:
July 14, 2022
Filing Date:
December 14, 2021
Export Citation:
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Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
G03B17/02; G02B7/02; G03B30/00
Domestic Patent References:
WO2010035696A12010-04-01
Foreign References:
CN210142251U2020-03-13
JP2019155694A2019-09-19
JP2010221572A2010-10-07
JP2018173431A2018-11-08
JP2018173431A2018-11-08
JP2010221572A2010-10-07
JP2019155694A2019-09-19
Attorney, Agent or Firm:
MINAMI AOYAMA PATENT AND TRADEMARK ATTORNEYS (JP)
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