Title:
SENSOR AND TOF CAMERA USING SAME
Document Type and Number:
WIPO Patent Application WO/2023/153914
Kind Code:
A1
Abstract:
The present invention relates to a ToF sensor and a ToF camera using same, the ToF sensor enabling a light-emitting unit and a light-receiving unit to be packaged into one or two system-in-packages (SIPs) at a wafer level by using semiconductor packaging according to fan out wafer level packaging (FOWLP), thereby implementing an ultra-thin package. The ToF camera of the present invention comprises: a light-emitting unit for emitting light at an object; a light-receiving unit for receiving reflected light reflected from the object and sensing same; a lens unit for controlling the path of the light so that the light is emitted at the object and the reflected light reflected from the object is received by the light-receiving unit; and a control unit having a controller printed circuit board (PCB), which has the light-emitting unit and the light-receiving unit mounted on the bottom surface thereof and has the lens unit mounted on the top surface thereof.
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| WO/2014/207635 | LIGHT EMITTING DIODE DEVICE |
Inventors:
CHOI SEONG WOOK (KR)
Application Number:
PCT/KR2023/002139
Publication Date:
August 17, 2023
Filing Date:
February 14, 2023
Export Citation:
Assignee:
LIPAC CO LTD (KR)
International Classes:
H01L25/16; H01L23/538
Foreign References:
| US20150262984A1 | 2015-09-17 | |||
| KR20210155382A | 2021-12-22 | |||
| US20180182913A1 | 2018-06-28 | |||
| KR20190092694A | 2019-08-08 | |||
| KR20080069549A | 2008-07-28 | |||
| KR20190090180A | 2019-08-01 |
Attorney, Agent or Firm:
LEE, Jae Hwa (KR)
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