SENSOR, VALVE DEVICE, AND THERMAL MANAGEMENT SYSTEM

WIPO Patent Application WO/2022/142738

A1

A sensor (100), a valve device (200) having same, and a thermal management system (900). The sensor (100) comprises: a housing (10), a substrate assembly (40), a temperature sensing unit (50), and a pressure sensing unit (60). The sensor (100) has an accommodating cavity (102) and a flow channel (101) that are located on different sides in the thickness direction of a substrate (41); the flow channel (101) is not communicated with the accommodating cavity (102); and electronic components (45) and the pressure sensing unit (60) are located in the accommodating cavity (102). The temperature sensing unit (50) is electrically connected to the electronic elements (45), and the pressure sensing unit (60) is electrically connected to the electronic elements (45). The substrate (41) comprises a first surface (411) facing the accommodating cavity (102) and a second surface (412) facing the flow channel (101), and the distance from the pressure sensing unit (60) to the first surface (411) is less than the distance from the pressure sensing unit (60) to the second surface (412). Parts such as pins of the pressure sensing unit (60) are protected by the structure of the substrate (41), and the substrate (41) is of an integrated structure, such that the structure is simple.

WAN XIA (CN)
JIN QIHONG (CN)
HUANG LONGZHONG (CN)
HUANG LINJIE (CN)

PCT/CN2021/129178

July 07, 2022

November 08, 2021

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HANGZHOU SANHUA RES INST CO LTD (CN)

G01D21/02; G01D11/00

CN113108830A	2021-07-13
CN105466483A	2016-04-06
CN105424260A	2016-03-23
CN107615034A	2018-01-19
US20170038272A1	2017-02-09
EP1096241A1	2001-05-02
CN104748905A	2015-07-01
JP2020056711A	2020-04-09
CN107817015A	2018-03-20

SUZHOU JIABO INTELLECTUAL PROPERTY (CN)

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