Title:
SENSOR
Document Type and Number:
WIPO Patent Application WO/2003/077318
Kind Code:
A1
Abstract:
A semiconductor chip (S) is provided with photodiodes (PD) and output terminals (T) of optical sensing elements. A circuit board (C) is provided with input terminals (I) for receiving signals from the output terminals (T) of the semiconductor chip (S). A connection means (CM) connects the terminals (T) to the respective input terminals (I). The intervals between the input terminals (I) are smaller than those between the output terminals (T). This sensor has a signal reading circuit (A) outside an input terminal formation region (RI) of the circuit board (C), so that the dimensions of the circuit board (C) are made smaller than those of the semiconductor chip (S). Therefore, when sensors (D) are arrayed, the semiconductor chips (S) are disposed close to or in contact with each other, thereby suppressing a decrease in the resolution of a sensor connecting section.
Inventors:
SHIBAYAMA KATSUMI
Application Number:
PCT/JP2003/002803
Publication Date:
September 18, 2003
Filing Date:
March 10, 2003
Export Citation:
Assignee:
HAMAMATSU PHOTONICS KK (JP)
International Classes:
G01T1/20; H01L27/14; H01L27/144; H01L27/146; H01L31/09; (IPC1-7): H01L27/14; G01T1/24
Foreign References:
| JPH0435474A | 1992-02-06 | |||
| JP2001339057A | 2001-12-07 | |||
| JPH05268535A | 1993-10-15 |
Other References:
See also references of EP 1492168A4
Attorney, Agent or Firm:
Hasegawa, Yoshiki (Ginza First Bldg. 10-6, Ginza 1-chom, Chuo-ku Tokyo, JP)
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