Title:
SERVER, DUAL-MEMORY PACKAGING MODULE, AND CONNECTOR
Document Type and Number:
WIPO Patent Application WO/2024/093189
Kind Code:
A1
Abstract:
The present disclosure relates to a server, a dual-memory packaging module, and a connector. The connector comprises a body (210). The body (210) is provided with a first groove (211), a second groove (212), and an insertion portion (213). The first groove (211) and the second groove (212) are each provided with a conductive member electrically connected to a memory module. Two opposite sides of the insertion portion (213) are each provided with a gold finger. The conductive member of the first groove (211) and the conductive member of the second groove (212) are electrically connected to the gold fingers, respectively.
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Inventors:
JI GUANGMENG (CN)
FANG YADE (CN)
FANG YADE (CN)
Application Number:
PCT/CN2023/093748
Publication Date:
May 10, 2024
Filing Date:
May 12, 2023
Export Citation:
Assignee:
CHANGXIN MEMORY TECH INC (CN)
International Classes:
G06F1/18
Foreign References:
CN109074136A | 2018-12-21 | |||
US20090007048A1 | 2009-01-01 | |||
CN107291644A | 2017-10-24 | |||
CN106776420A | 2017-05-31 | |||
CN107994364A | 2018-05-04 | |||
CN112969340A | 2021-06-15 | |||
CN114898785A | 2022-08-12 | |||
US20070258217A1 | 2007-11-08 |
Attorney, Agent or Firm:
ADVANCE CHINA IP LAW OFFICE (CN)
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