Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SERVER, DUAL-MEMORY PACKAGING MODULE, AND CONNECTOR
Document Type and Number:
WIPO Patent Application WO/2024/093189
Kind Code:
A1
Abstract:
The present disclosure relates to a server, a dual-memory packaging module, and a connector. The connector comprises a body (210). The body (210) is provided with a first groove (211), a second groove (212), and an insertion portion (213). The first groove (211) and the second groove (212) are each provided with a conductive member electrically connected to a memory module. Two opposite sides of the insertion portion (213) are each provided with a gold finger. The conductive member of the first groove (211) and the conductive member of the second groove (212) are electrically connected to the gold fingers, respectively.

More Like This:
JPS62172438INTEGRATED CIRCUIT MOUNTING METHOD
JP7404425System level structure for blind mating connections
JP2009145958SWING-TYPE PORTABLE TERMINAL EQUIPMENT FOR REDUCING INTERFERENCE OF FPCB
Inventors:
JI GUANGMENG (CN)
FANG YADE (CN)
Application Number:
PCT/CN2023/093748
Publication Date:
May 10, 2024
Filing Date:
May 12, 2023
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
CHANGXIN MEMORY TECH INC (CN)
International Classes:
G06F1/18
Foreign References:
CN109074136A2018-12-21
US20090007048A12009-01-01
CN107291644A2017-10-24
CN106776420A2017-05-31
CN107994364A2018-05-04
CN112969340A2021-06-15
CN114898785A2022-08-12
US20070258217A12007-11-08
Attorney, Agent or Firm:
ADVANCE CHINA IP LAW OFFICE (CN)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: SIGNAL DETECTION METHOD, SIGNAL PROCESSING METHOD AND SIGNAL PROCESSING MODEL

Next Patent: SEMICONDUCTOR STRUCTURE MANUFACTURING METHOD, AND SEMICONDUCTOR STRUCTURE