Title:
SETTLEMENT SYSTEM AND SETTLEMENT METHOD
Document Type and Number:
WIPO Patent Application WO/2020/179505
Kind Code:
A1
Abstract:
A settlement system according to the present invention comprises: a settlement request device which has a processor and memory; a settlement execution device which has a processor and memory; and an electronic obligation management device which manages electronic credit and obligations. The settlement request device issues a payment request generated by an electronic settlement medium. The settlement execution device receives the payment request generated by the settlement medium, records the generation of a obligation, resulting from the payment request, in the electronic obligation management device, and transmits the settlement medium to a recipient.
Inventors:
JIN YUSUKE (JP)
YAMADA NISHIO (JP)
HASHIMOTO YASUNORI (JP)
YAMADA NISHIO (JP)
HASHIMOTO YASUNORI (JP)
Application Number:
PCT/JP2020/007098
Publication Date:
September 10, 2020
Filing Date:
February 21, 2020
Export Citation:
Assignee:
HITACHI LTD (JP)
International Classes:
G06Q40/02
Foreign References:
| JP2015204063A | 2015-11-16 | |||
| JP2003016368A | 2003-01-17 | |||
| JP2018190156A | 2018-11-29 | |||
| JP2019095837A | 2019-06-20 | |||
| JP2019101657A | 2019-06-24 |
Attorney, Agent or Firm:
TOU-OU PATENT FIRM (JP)
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