Title:
SHAPE TRANSFER FILM
Document Type and Number:
WIPO Patent Application WO/2021/141098
Kind Code:
A1
Abstract:
Provided is a shape transfer film with an uneven shape that is capable of imparting sufficient hiding power to a transfer object by transferring a shape derived from the uneven shape to the transfer object, said shape transfer film being easily peeled off when same is intentionally removed from the transfer object. A shape transfer film 1 has an uneven shape on at least one side thereof, the uneven shape having a developed interfacial area ratio Sdr of 1500-7000% and/or a core level difference Sk of 2.0-7.0 μm. The shape transfer film 1 is used to transfer the shape derived from the uneven shape to a transfer object. The shape transfer film 1 comprises: a substrate layer 2; and a resin layer 3 provided on one side of the substrate layer 2, for example. Furthermore, the shape transfer film 1 includes a filler 4, and the uneven shape is formed by the filler 4 protruding outward from a flat film surface 3a, for example.
Inventors:
UMEMURA SHIGEKAZU (JP)
Application Number:
PCT/JP2021/000419
Publication Date:
July 15, 2021
Filing Date:
January 08, 2021
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
H05K9/00; B32B3/30; H05K1/02; H05K3/28
Foreign References:
| JP2017071107A | 2017-04-13 |
Attorney, Agent or Firm:
GOTO & CO. (JP)
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