Title:
SHEET MOLDING COMPOUND RESIN COMPOSITION, SHEET MOLDING COMPOUND, MOLDED ARTICLE, AND METHOD FOR PRODUCING SHEET MOLDING COMPOUND
Document Type and Number:
WIPO Patent Application WO/2021/131571
Kind Code:
A1
Abstract:
Provided is a sheet molding compound resin composition characterized by containing a thermosetting resin (A), a resin curing agent (B), and a glycidyl ether (C) comprising a C7–14 alkyl group and a glycidyl group. This sheet molding compound resin composition has superior carbon fiber impregnability regardless of resin viscosity, and thus can be suitably used in a sheet molding compound and a molded article of said sheet molding compound.
Inventors:
HITOMI KAZUTOSHI (JP)
Application Number:
PCT/JP2020/044984
Publication Date:
July 01, 2021
Filing Date:
December 03, 2020
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08G59/36; C08J5/04; C08K7/02; C08L63/00
Domestic Patent References:
| WO2018190329A1 | 2018-10-18 |
Foreign References:
| JPS62184053A | 1987-08-12 | |||
| JPH09194544A | 1997-07-29 | |||
| US20100041802A1 | 2010-02-18 | |||
| JP2007039602A | 2007-02-15 | |||
| JP2004035714A | 2004-02-05 |
Attorney, Agent or Firm:
OGAWA Shinji (JP)
Download PDF: