Title:
SHELL, HOUSING ASSEMBLY, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/065804
Kind Code:
A1
Abstract:
Embodiments of the present application provide a shell, comprising a cover plate and a heat dissipation assembly mounted on the cover plate. The heat dissipation assembly comprises a first cavity, a second cavity, a first pipe, and a dynamic functional part; the first cavity is filled with a phase change medium in a first phase; and when the phase change medium is subjected to phase change to be in a second phase due to heating and enters the first pipe from the first cavity, the dynamic functional part is driven by the phase change medium in the second phase to change the form. According to the shell provided by the embodiments of the present application, the first cavity is arranged corresponding to a heat generation element of an electronic device; when the heat generation element generates heat, the phase change medium in the first cavity can diffuse the heat, and the phase change medium during motion can also act on the dynamic functional part to drive the dynamic functional part to change the form, such that part of heat energy is converted into mechanical energy to be consumed, heat can be quickly dissipated, and the dynamic effect of the housing can also be achieved. In addition, the embodiments of the present application further provide a housing assembly and an electronic device.
More Like This:
Inventors:
YE WANJUN (CN)
Application Number:
PCT/CN2022/113726
Publication Date:
April 27, 2023
Filing Date:
August 19, 2022
Export Citation:
Assignee:
GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP LTD (CN)
International Classes:
H05K5/02
Foreign References:
| CN105578840A | 2016-05-11 | |||
| CN108377634A | 2018-08-07 | |||
| CN113905565A | 2022-01-07 | |||
| CN110167325A | 2019-08-23 | |||
| JP2012067613A | 2012-04-05 |
Attorney, Agent or Firm:
SHENZHEN ZHIQUAN INTELLECTUAL PROPERTY OFFICE (CN)
Download PDF: