Title:
SHIELD PRINTED WIRING BOARD AND METHOD OF MANUFACTURING SHIELD PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2020/122166
Kind Code:
A1
Abstract:
Provided is a shield printed wiring board that has excellent connection stability and a high degree of freedom in circuit design even when the area of an opening part of a through-hole is small. The shield printed wiring board 1 of the present invention comprises: a printed wiring board 10; an insulation layer 22; and a conductive adhesive layer 21 disposed between the printed wiring board 10 and the insulation layer 22, wherein the printed wiring board 10 has a base member 11, a circuit pattern 13 provided on the surface of the base member, and an insulating protective layer 14 covering the circuit pattern 13, a through-hole 23 for external ground connection is provided which penetrates the insulation layer 22 and the conductive adhesive layer 21 in the thickness direction, and the conductive adhesive layer 21 has an extension part 21a extending inward of the through-hole 23 from the insulation layer 22.
Inventors:
HARUNA YUUSUKE (JP)
YAMAUCHI SHIROU (JP)
TAJIMA HIROSHI (JP)
ISHIOKA SOUGO (JP)
YAMAUCHI SHIROU (JP)
TAJIMA HIROSHI (JP)
ISHIOKA SOUGO (JP)
Application Number:
PCT/JP2019/048648
Publication Date:
June 18, 2020
Filing Date:
December 12, 2019
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
H05K9/00; H05K1/02; H05K1/03; H05K3/00
Domestic Patent References:
| WO2016032006A1 | 2016-03-03 |
Foreign References:
| JP2018041953A | 2018-03-15 | |||
| JP2017059801A | 2017-03-23 |
Attorney, Agent or Firm:
GOTO & CO. (JP)
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