Title:
SHIELDING FILM HAVING MULTI-LAYERED METAL STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2021/004177
Kind Code:
A1
Abstract:
Provided is a shielding film having a multi-layered metal structure, comprising an insulating layer and a multi-layered metal compounded on the insulating layer, wherein the thickness of each layer of metal is 0.05-5 μm, the multi-layered metal has 2-10 layers, and a conductive bonding layer is disposed between the multi-layered metal. In the present invention, the thickness of each layer of metal is controlled by means of providing a multi-layered metal, and a conductive bonding layer is bonded between the layers of metal such that the shielding film has good flexibility and an excellent shielding effect. Additionally, the conductive bonding layer is used so that the binding force between the layers of metal is good, and a high-frequency signal shielding performance of greater than 80db@10ghz is ensured so that the shielding film has good flexibility and meets flexibility requirements for flexible circuit boards while also having good high-temperature resistance. When the shielding film is impacted by high temperatures, the binding force between the metal layers does not weaken and is stable and reliable.
Inventors:
TIAN HAIYU (CN)
Application Number:
PCT/CN2020/092540
Publication Date:
January 14, 2021
Filing Date:
May 27, 2020
Export Citation:
Assignee:
HAINING ZHUOTAI ELECTRONIC MAT CO LTD (CN)
International Classes:
H05K9/00
Domestic Patent References:
| WO2007119513A1 | 2007-10-25 |
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Attorney, Agent or Firm:
UNITALEN ATTORNEYS AT LAW (CN)
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