COMPONENTS

RELATED APPLICATION

[0001] This application claims priority on U.S. Provisional Application No: 63/076,309 filed on September 9, 2020, and entitled “SHORT TRANSMISSION CONNECTOR ASSEMBLY FOR ELECTRICAL COMPONENTS”. As far as permitted, the contents of U.S. Provisional Application No: 63/076,309 are incorporated herein.

BACKGROUND

[0002] Many electrical applications require a connector assembly for electrically connecting a pulse generator to an electronic device which has a low or a variable impedance. This is not a trivial task because the type of connector assembly utilized can cause a significant distortion (“Gibbs phenomenon”) of the pulsed signal generated by the pulse generation that is received by the electronic device. For example, for a rectangular shaped pulses signal, the connector assembly can cause distortion such as overshoot and/or ringing at the pulse edges. For certain electronic devices such as a semiconductor device, the distortion of the pulsed signal can damage or destroy the electronic device.

[0003] Currently, there are two standard approaches for the connector assembly. The first approach is using a standard fifty Ohm or seventy-five Ohm radiofrequency (“RF”) outputs and RF cables as the connector assembly. However, this approach requires a high voltage pulse generator to provide a current of five amperes or higher.

[0004] A second approach includes using a high current MOSFET transistor and load, which is directly connected to the transistor output as the connector assembly. With the second approach, that there should be no significant gap between pulse generator and the electronic device(s). Unfortunately, in many cases, it is not practical to place the electronic device that close to the pulse generator. [0005] Accordingly, existing connector assemblies are not entirely satisfactory for electrically connecting a pulse generator to an electronic device.

SUMMARY

[0006] The present invention is directed to a connector assembly for electromagnetically connecting a pulse generator to an electronic device. In one implementation, the connector assembly includes: a short, first strip transmission line, and a short, second strip transmission line that electromagnetically connect the pulse generator and the electronic device. The strip transmission lines are physically coupled together. The first strip transmission line has a first strip transmission line impedance and the second strip transmission line has a second strip transmission line impedance that is different from the first strip transmission line impedance.

[0007] In one implementation, the connector assembly includes (i) an electrically conductive, first ground layer; (ii) an electrically conductive, first signal layer; (iii) a first insulation layer that separates and spaces apart the first ground layer from the first signal layer, the first insulation layer fixedly coupling the first signal layer to the first ground layer; (iv) an electrically conductive second ground layer; and (v) a second insulation layer that separates and spaces apart the first signal layer from the second ground layer, the second insulation layer fixedly coupling the first signal layer to the second ground layer. In this design, (i) the first ground layer, the first signal layer, and the first insulation layer cooperate to define the first strip transmission line; and (ii) the second ground layer, the first signal layer, and the second insulation layer cooperate to define the second strip transmission line.

[0008] As an overview, the connector assembly electromagnetically transmits a generated pulsed signal from the pulse generator, and is uniquely designed so that a delivered pulsed signal at the electronic device has very little, if any overshoot. Stated in a different fashion, the design of the ground, signal and insulation layers can be readily and accurately adjusted to optimize the transmission of the generated pulsed signal from the pulse generator to the electronic device, even if the electronic device has a dynamic device impedance. As a result thereof, the operational life of the electronic device will be improved, the control of the electronic device will be improved, and/or the performance of the electronic device will be enhanced.

[0009] The first ground layer has a first ground layer parameter, the first insulation layer has a first insulation layer parameter, and the first signal layer has a first signal layer parameter. As provided herein, the layer parameters are selected to adjust the first strip transmission line impedance of the first strip transmission line. For example, a first ground layer thickness of the first ground layer, a first insulation layer thickness of the first insulation layer, and a first signal layer thickness of the first signal layer can be adjusted to achieve the desired first strip transmission line impedance that will reduce distortion and inhibit overshooting of the delivered pulsed signal.

[0010] Additionally, the second ground layer has a second ground layer parameter, and the second insulation layer has a second insulation layer parameter. With this design, the layer parameters are selected to adjust the first strip transmission line impedance of the first strip transmission line, and the second strip transmission line impedance of the second strip transmission line. For example, the layer parameters are selected so that the first strip transmission line impedance is different from the second strip transmission line impedance. Moreover, the layer parameters are selected to reduce distortion and overshooting of the delivered pulsed signal. In a specific example, a layer thickness of each layer is selected to minimize overshoot of the delivered pulsed signal.

[0011] Moreover, the connector assembly can include (i) an electrically conductive, second signal layer that provides an electromagnetic connection between the pulse generator and the electronic device; (ii) a third insulation layer that separates the second ground layer from the second signal layer, and fixedly couples the second ground layer to the first signal layer; (iii) an electrically conductive, third ground layer that provides an electromagnetic connection between the pulse generator and the electronic device; and (iv) a fourth insulation layer that separates the third ground layer from the second signal layer, and fixedly couples the third ground layer to the first signal layer. In this implementation, the third insulation layer, the second ground layer and the second signal layer cooperate to form a third trip transmission line that provides an electromagnetic connection between the pulse generator and the electronic device; and the fourth insulation layer, the third ground layer and the second signal layer cooperate to form a fourth trip transmission line that provides an electromagnetic connection between the pulse generator and the electronic device.

[0012] In another implementation, the present invention is directed to a method for electromagnetically connecting a pulse generator to an electronic device that includes: (i) electromagnetically connecting the pulse generator to the electronic device with an electrically conductive first ground layer, the first ground layer having at least one first ground layer parameter; (ii) electromagnetically connecting the pulse generator to the electronic device with an electrically conductive first signal layer, the first signal layer having at least one first signal layer parameter; wherein the first signal layer and the first ground layer cooperate to define a first strip transmission line; (iii) separating the first ground layer from the first signal layer with a first insulation layer that couples the first ground layer to the first signal layer, the first insulation layer having a first insulation layer parameter; and (iv) selecting the first ground layer parameter, the first insulation layer parameter, and the first signal layer parameter to select a first strip transmission line impedance of the first transmission line.

[0013] In yet another implementation, the present invention is directed an electronic assembly that includes: (i) an electronic device having a device impedance; (ii) a pulse generator that generates a generated pulsed signal, the pulse generator having a generator impedance; and (iii) a connector assembly that electromagnetically connects the pulse generator to the electronic device. The connector assembly includes (i) an electrically conductive, first ground layer that electromagnetically connects the pulse generator and the electronic device, the first ground layer being a conductive strip having at least one, first ground layer parameter; (ii) an electrically conductive, first signal layer that electromagnetically connects the pulse generator and the electronic device, the first signal layer being a conductive strip having at least one, first signal layer parameter; (iii) a first insulation layer that separates and spaces apart the first ground layer from the first signal layer, and fixedly couples the first ground layer to the first signal layer, the first insulation layer having a first insulation layer parameter; (iv) an electrically conductive, second ground layer that electromagnetically connects the pulse generator and the electronic device, the second ground layer being a conductive strip having at least one, second ground layer parameter; and (v) a second insulation layer that separates and spaces apart the second ground layer from the first signal layer, and fixedly couples the second ground layer to the first signal layer, the second insulation layer having a second insulation layer parameter. The first insulation layer, the first ground layer and the first signal layer cooperate to define a first strip transmission line having a first strip transmission line impedance. The second insulation layer, the second ground layer and the first signal layer cooperate to define a second strip transmission line having a second strip transmission line impedance. As provided herein, the layer parameters are selected to achieve the desired first strip transmission line impedance and second strip transmission line impedance based on the device impedance and the generator impedance to reduce distortion and overshooting of the delivered pulsed signal.

BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The novel features of this invention, as well as the invention itself, both as to its structure and its operation, will be best understood from the accompanying drawings, taken in conjunction with the accompanying description, in which similar reference characters refer to similar parts, and in which:

[0015] Figure 1 is a simplified side view of an electronic assembly that includes a connector assembly, and an electronic device;

[0016] Figure 2A is a simplified perspective view of the connector assembly and the electronic device of Figure 1 ;

[0017] Figure 2B is a simplified cut-away view of the connector assembly taken on line 2B-2B in Figure 2A;

[0018] Figure 3 is a simplified graph that illustrates a generated pulsed signal, and two, alternative delivered pulsed signals;

[0019] Figure 4 is a simplified perspective view of another implementation of the connector assembly with the electronic device;

[0020] Figure 5 is a simplified cut-away view of yet another implementation of the connector assembly; [0021] Figure 6 is a simplified top view of another implementation of the connector assembly;

[0022] Figure 7 is a simplified top view of still another implementation of the connector assembly;

[0023] Figure 8 is a simplified top view of yet another implementation of the connector assembly;

[0024] Figure 9 is a simplified top view of another implementation of the connector assembly;

[0025] Figure 10 is a simplified top view of yet another implementation of the connector assembly;

[0026] Figure 11 is a simplified top view of still another implementation of the connector assembly; and

[0027] Figure 12 is a simplified top view of another implementation of the connector assembly.

DESCRIPTION

[0028] Figure 1 is simplified illustration of a non-exclusive implementation of an electronic assembly 10. The number of components of the electronic assembly 10, and design of each component can be varied to achieve the design requirements of the electronic assembly 10. In the simplified implementation of Figure 1 , the electronic assembly 10 includes (i) a pulse generator 12 that generates a generated pulsed signal 12A, (ii) an electronic device 14, (iii) a connector assembly 16 that electrically connects the pulse generator 12 to the electronic device 14, (iv) a control system 18 that controls the components of the electronic assembly 10, and (v) a power source 19.

[0029] As an overview, the connector assembly 16 transmits the generated pulsed signal 12A, and is uniquely designed to minimize distortion (e.g. minimize overshoot and/or ringing at the pulse edges) so that a delivered pulsed signal 20 at the electronic device 14 has minimal distortion. As a result thereof, the operational life of the electronic device 14 will be improved, the control of the electronic device 14 will be improved, and/or the performance of the electronic device 14 will be enhanced. [0030] More specifically, in certain implementations, the connector assembly 16 can define two or more short strip transmission lines that electromagnetically connect the pulse generator 12 to the electronic device 14, and the short strip transmission lines have different impedances. With this design, the impedances of the short strip transmission lines are designed to allow for the proper amount of bouncing (reflecting) of the pulsed signal 12A in the connector assembly 16 to minimize overshoot and reduce ringing at the pulse edges of the delivered pulsed signal 20.

[0031] As used herein, the term short strip transmission have a length that is shorter than A, where lamda (A) is a wavelength of a connector cutoff frequency of the connector assembly 16; or have a length that causes a time delay (time it takes for the signal to travel from one end to the other end of each of the strip transmission lines) less than 0.3 nanoseconds or less than one percent (1%) of the transmitted pulse duration.

[0032] As provided herein, the design of the connector assembly 16 can be readily and accurately adjusted to optimize the transmission of the generated pulsed signal 12A from the pulse generator 12 to the electronic device 14, even if the electronic device 14 has a dynamic device impedance. In certain implementation, the connector assembly 16 is designed to save the shape of the generated pulse signal 12A so that the delivered pulsed signal 20 closely approximates the generated pulsed signal 12A and the delivered pulsed signal 20 has minimal (if any) overshoot.

[0033] In certain implementations, one or more layer parameters of the connector assembly 16 can be readily and accurately adjusted so that the connector assembly 16 better matches the design of the pulse generator 12 and the design of the electronic device 14. For example, a thickness, material, length, width, and/or shape of one or more of the layers in the connector assembly 16 can be readily adjusted. Moreover, in certain designs, the generated pulsed signal 12A from the pulse generator 12 can have some overshoot. As provided herein, the connector assembly 16 can be designed to minimize the overshoot in the delivered pulsed signal 20, and act as a buffer between the pulse generator 12 and the electronic device 14.

[0034] Additionally, the connector assembly 16 is relatively easy to manufacture and adjust to achieve the desired impedance characteristics of the connector assembly 16. Moreover, the connector assembly 16 is uniquely designed to minimize interference from neighboring components that can change the capacitance and/or impedance of the connector assembly 16. This further inhibits distortion of the delivered pulsed signal 20. [0035] Furthermore, in certain implementations, the connector assembly 16 forms two or more, short strip transmission lines (“RF connectors”) that allow for: (i) better performance (better matching of the MOSFET line) with remote electronic devices 14 having variable impedance; (ii) the electronic device 14 to be positioned at a relatively large distance from the pulse generator 12; (iii) fabricating more rigid RF connectors for low impedance electronic devices 14; and/or (iv) relatively inexpensive RF connectors by using standard materials and technologies of printed circuit board (“PCB”) manufacturing.

[0036] The pulse generator 12 generates the generated pulsed signal 12A. In certain implementations, the pulse generator 12 can be controlled by the control system 18 to set the properties (e.g. amplitude, frequency, and wave shape) of the generated pulsed signal 12A. The desired properties of the generated pulsed signal 12A will depend upon the desired usage of the electronic device 4 and the electronic assembly 10. As a non-exclusive example, the generated pulsed signal 12A can have a rectangular shaped pulse.

[0037] As provided herein, the pulse generator 12 will have one or more generator parameters, such as a generator impedance. In certain implementations, the pulse generator 12 includes a metal-oxide-semiconductor field-effect transistor (“MOSFET”) that has relatively low impedance. In certain implementations, the generator impedance can vary during generation of the generated pulsed signal 12A.

[0038] The electronic device 14 receives the delivered pulsed signal 20 from the connector assembly 16. The electronic device 14 can also be referred to as a load.

[0039] The design of the electronic device 14 can be varied to suit the requirements of the electronic assembly 10. In one non-exclusive implementation, the electronic device 14 is a tunable laser assembly that directly generates and emits a laser beam that is tunable over a tunable range over time. The tunable laser assembly can be an external cavity, Littrow configuration that includes a gain medium 14A (illustrated as a box in phantom), a sub-mount 14B (illustrated as a box in phantom) that retains the gain medium 14A, and a wavelength selective element 14C (illustrated as a box in phantom). For example, the gain medium 14A can be a semiconductor, a quantum cascade gain medium, or another type of gain medium 14A. In one specific example, the laser assembly is a tunable mid-infrared (“MIR”) laser, and the tunable range is a portion or all of a mid-infrared range.

[0040] For the Littrow configuration, the wavelength selective element 14C is adjusted to precisely select, tune, and adjust the lasing frequency of the gain medium 14A and the center wavelength of the light generated by the gain medium 14A. A number of alternative embodiments of the wavelength selective element 14C can be utilized. As a non-exclusive implementation, the wavelength selective element 14C can be a diffraction grating that is selectively moved by a grating mover under the control of the control system 18 to rapidly adjust the lasing frequency of the gain medium 14A.

[0041] As provided above, the delivered pulsed signal 20 directs voltage to the gain medium 14A in a pulsed fashion. As a result thereof, the laser assembly generates a pulsed laser beam. For a mid-infrared laser assembly, the delivered pulsed signal 20 can include nanosecond pulses of voltage.

[0042] It should be noted that each different electronic device 14 will have one or more device parameters, such as a device impedance. In certain electronic devices 14, the device impedance is substantially constant during operation of the electronic device 14. As alternative, non-exclusive examples, the device impedance can be approximately two, eight, twenty, or one hundred (1 , 8, 20, or 100) ohms. Alternatively, the device impedance can be greater than or lesser than these values.

[0043] However, in other implementations, the device impedance of the electronic device 14 will vary (variable impedance) during operation of the electronic device 14. As alternative, non-exclusive examples, the device impedance can vary between four and twenty ohms; between four and two hundred ohms; between eight and one hundred ohms; between eight and one thousand ohms; between four and one thousand ohms; or between twelve and three hundred ohms during operation of the electronic device 14. Alternatively, the device impedance can vary greater than or lesser than these values during operation of the electronic device 14. [0044] In a specific example, the device impedance of a semiconductor laser assembly (the electronic device 14) varies as the laser assembly is tuned, and the wavelength changes. For example, for a semiconductor laser assembly, the device impedance can vary from several ohms to hundreds of ohms during operation of the laser assembly.

[0045] As discussed above, the connector assembly 16 electromagnetically connects the pulse generator 12 to the electronic device 14. As provided herein, the connector assembly 16 can include two or more ground layers, one or more signal layers, and two or more insulation layers that cooperate to form two or more short strip transmission lines. A number of different embodiments of the connector assembly 16 are described herein.

[0046] In the non-exclusive implementation illustrated in Figure 1 , the connector assembly 16 is a generally rectangular shaped, and forms two, strip transmission lines. In this example, the connector assembly 16 includes (i) a first ground layer 22, (ii) a first insulator 24, (iii) a first signal layer 26, (iv) a second insulator 28, and (v) a second ground layer 30. In this implementation, (i) the first ground layer 22, the first insulation layer 24, and the first signal layer 26 cooperate to form a first, short strip transmission line 31 A; and (ii) the second ground layer 30, the second insulation layer 28, and the first signal layer 26 cooperate to form a second, short strip transmission line 31 B. Alternatively, the connector assembly 16 can be designed to include more or fewer components than illustrated in Figure 1 .

[0047] As provided above, the connector impedance of the connector assembly 16 is selected to achieve the desired transmission characteristics of the connector assembly 16. Stated in another fashion, the impedance of each strip transmission line 31 A, 31 B is selected to achieve the desired transmission characteristics of the connector assembly 16. For example, the layer parameters of one or more of the ground layers 22, 30; one or more insulation layers 24, 28; and/or one or more of the signal layers 26 can be tuned to achieve the desired impedance of each strip transmission line 31 A, 31 B. The connector assembly 16 is described in more detail below.

[0048] The control system 18 controls one or more components of the electronic assembly 10. For example, the control system 18 can control the pulse generator 12 to control the generated pulsed signal 12A, and the electronic device 14. In one nonexclusive implementation, the control system 18 can include one or more processors 18A and/or one or more electronic data storage devices 18B. It should be noted that the control and analysis system 18 is illustrated in Figure 1 as a single, central processing system. Alternatively, the control and analysis system 18 can be a distributed processing system.

[0049] The power source 19 provides power to the pulse generator 12 and the control system 18. As non-exclusive examples, the power source 19 can be the power grid, a battery or a generator.

[0050] Figure 2A is a perspective view of the connector assembly 16 and the electronic device 14 of Figure 1. As discussed above, in this example, the connector assembly 16 includes (i) the first ground layer 22 (illustrated in phantom), (ii) the first insulation layer 24, (iii) the first signal layer 26 (illustrated in phantom), (iv) the second insulation layer 28, and (v) the second ground layer 30. Additionally, in this example, the connector assembly 16 includes (i) a ground output connector 32 that electrically connects the ground layers 22, 30 to the electronic device 14; and (ii) a signal output connector 34 that electrically connects the ground layers 22, 30 to the electronic device 14. The design of these components can be varied to achieve the desired connector parameters, e.g. impedance of each strip transmission line and the connector assembly 16. This will allow the connector assembly 16 to be made (tuned) to fit the generator parameters and the device parameters.

[0051] In the non-exclusive implementation of Figure 2A, the connector assembly 16 is generally rectangular box shaped. Moving from bottom to top, (i) the first ground layer 22 is secured to the bottom of the first insulation layer 24; (ii) the first signal layer 26 is secured to the top of the first insulation layer 24; (iii) the second insulation layer 28 is positioned on top of and secured to the first signal layer 26; and (v) the second ground layer 30 is secured to the top of the second insulation layer 28. With this design, (i) the first insulation layer 24 separates and mechanically couples the first ground layer 22 to the first signal layer 26; and (ii) the second insulation layer 28 separates and mechanically couples the second ground layer 22 to the first signal layer 26. [0052] The layer dimensions and/or properties of each of the layers 22, 24, 26, 28 and 30 can be specifically designed to achieve the desired connector parameters (e.g. strip transmission line impedances). In the non-exclusive implementation of Figure 2A, (i) each layer 22, 24, 26, 28 and 30 is generally rectangular shaped; (ii) each ground layers 22, 30 is electrically conductive (e.g. copper or other conductive material) and can be made of a metal strip; (iii) the signal layer 26 is electrically conductive (e.g. copper or other conductive material) and can be made of a strip metal; and (iv) each insulation layer 24, 28 is electrically non-conductive and can be made of a dielectric material.

[0053] Alternatively, each of the layers 22, 24, 26, 28 and 30 can have a different shape than illustrated in Figure 2A. For example, one or more of the layers 22, 24, 26, 28 and 30 can be triangle, trapezoidal, rectangle with holes, etc. For example, the trapezoidal shape can provide better matching of the impedance of the pulse generator 12 to the electronic device 14, when their impedances are not equal.

[0054] Figure 2B is a simplified cutaway view taken on line 2B-2B of Figure 2A. It should be noted that the layer thicknesses of the ground and signal layers 22, 26, 30 are exaggerated in Figure 2B for clarity.

[0055] With reference to Figures 2A and 2B, (i) the first ground layer 22 has a first ground layer length 22A (measured along the Y axis), a first ground layer width 22B (measured along the X axis), a first ground layer thickness 22C (measured along the Z axis), and is made from first ground material (collectively “first ground layer parameters”); (ii) the first insulation layer 24 has a first insulation layer length 24A (measured along the Y axis), a first insulation layer width 24B (measured along the X axis), a first insulation layer thickness 24C (measured along the Z axis) and is made from first insulation layer material (collectively “first insulation layer parameters”); (iii) the first signal layer 26 has a first signal layer length 26A (measured along the Y axis), a first signal layer width 26B (measured along the X axis), a first signal layer thickness 26C (measured along the Z axis), and is made from first signal material (collectively “first signal layer parameters”); (iv) the second insulation layer 28 has a second insulation layer length 28A (measured along the Y axis), a second insulation layer width 28B (measured along the X axis), a second insulation layer thickness 28C (measured along the Z axis), and is made from second insulation material (collectively “second insulation layer parameters”); and (v) the second ground layer 30 has a second ground layer length 30A (measured along the Y axis), a second ground layer width 30B (measured along the X axis), a second ground layer thickness 30C (measured along the Z axis), and is made from second ground material (collectively “second ground layer parameters”).

[0056] The insulation layer parameters can include thickness, overall dimensions, resistance, dielectric constant and dielectric losses of the insulation material.

[0057] In Figure 2A, (i) all of the layers 22, 24, 26, 28, 30 have the same layer length 22A, 24A, 26A, 28A, 30A; (ii) the insulation layer widths 24B, 28B are larger than the ground layer widths 22B, 30B; (iii) the ground layer widths 22B, 30B are larger than the signal layer width 26B; and (iv) the insulation layer thicknesses 24C, 28C are larger than the ground layer thicknesses 22C, 30C and the signal layer thickness 26C.

[0058] As a non-exclusive example, (i) each layer length 22A, 24A, 26A, 28A, 30A can be between approximately twenty-five millimeters and thirty millimeters; (ii) each insulation layer width can be 24B, 28B between approximately fifteen millimeters and thirty millimeters; (iii) each insulation layer thickness 24C, 28C can be between approximately 1.2 millimeters and 3.6 millimeters; (iv) each ground layer width 22B, 30B can be between approximately ten millimeters and twelve millimeters; (v) each ground layer thickness 22C, 30C can be between approximately thirty microns and sixty microns; (vi) the signal layer width 26B can be between approximately ten millimeters and twelve millimeters; and (vii) the signal layer thickness 26C can be between approximately thirty microns and sixty microns. However, other values are possible.

[0059] In one embodiment, the layer length 22A, 24A, 26A, 28A, 30A can be in the range of A/8 to 2A, where A - is a wavelength of the connector cutoff frequency of the connector assembly 16.

[0060] As provided above, in this implementation, (i) the first ground layer 22, the first insulation layer 24, and the first signal layer 26 cooperate to define the first strip transmission line 31 A; and (ii) the second ground layer 30, the second insulation layer 28, and the first signal layer 26 cooperate to define the second strip transmission line 31 B. It should be noted that one or more of the first ground layer parameters, one or more of the first insulation layer parameters, and/or one or more of the first signal layer parameters can be selected and adjusted to achieve a desired first strip transmission line impedance of the first strip transmission line 31 A. Similarly, one or more of the second ground layer parameters, one or more of the second insulation layer parameters, and/or one or more of the first signal layer parameters can be selected and adjusted to achieve a desired second strip transmission line impedance of the second strip transmission line 31 B. For example, (i) the first insulation layer thickness 24C, the first insulation material, and the first signal layer width 26B can be selected and adjusted to achieve the desired first strip transmission line impedance; and (ii) the second insulation layer thickness 28C, the second insulation material, and the first signal layer width 26B can be selected and adjusted to achieve the desired second strip transmission line impedance.

[0061] Stated in another fashion, one or more of the layer parameters can be adjusted to achieve the desired characteristics of the strip transmission lines 31 A, 31 B. In one non-exclusive implementation, the insulation layer thickness and insulation layer material (dielectric constant) are selected, and the widths of one or more of the ground layers 22, 30 or signal layer 26 is selected to achieve the desired first strip transmission line impedance and the second strip transmission line impedance.

[0062] The determination of the desired impedances of each of the strip transmission lines 31 A, 31 B should consider the multi bouncing process of the signal in the connector assembly 16 during the signal pulse transmission. As provided herein, the generator impedance and the device impedance can be put into a program (e.g. a simulator) that determines what values for the first strip transmission line impedance and the second strip transmission line impedance with result in the best delivered pulsed signal 20 (illustrated in Figure 1 ). Subsequently, the program can vary and determine (i) the first ground layer parameters, the first insulation layer parameters, and the first signal layer parameters necessary to achieve the desired first strip transmission line impedance; and (ii) the second ground layer parameters, the second insulation layer parameters, and the first signal layer parameters to achieve the desired second strip transmission line impedance. In one example, the program can vary and determine (i) the first insulation layer thickness 24C, the first insulation layer material (dielectric constant) and/or the first signal layer width 26B necessary to achieve the desired first strip transmission line impedance, and (ii) the second insulator layer thickness 28C, the second insulation layer material (dielectric constant) and/or the first signal layer width 26B to achieve the desired second strip transmission line impedance, that will inhibit overshooting in the delivered pulsed signal 20.

[0063] In one embodiment, these layer parameters are selected so that the first strip transmission line impedance is different from the second strip transmission line impedance. As alternative, non-exclusive examples, the layer parameters are selected so that first strip transmission line impedance is at least five, ten, fifteen, twenty, twenty- five, thirty, or thirty-five (5, 10, 15, 20, 25, 30 or 35) ohms different from the second strip transmission line impedance. However, other values are possible. For example, the first strip transmission line impedance can be greater or less than the second strip transmission line impedance.

[0064] As provided herein, the appropriate different strip transmission line impedances can determined (and the layer parameters selected to achieve these impedances) to provide the better delivered pulsed signal 20 for electronic devices 14 having variable impedance. Thus, the strip transmission line impedances can be determined and the layer parameters selected to provide a better, delivered pulsed signal 20.

[0065] Stated in another fashion, a number of stacked, short, strip transmission lines 31 A, 31 B that can interact with each other, inhibit distortion in the delivered pulsed signal 20 for applications where the electronic device 14 has a variable impedance. The short multi-transmission lines 31 A, 31 B can operate as a balanced as well as unbalanced line. The implementation in Figure 2A is considered as an asymmetric embedded microstrip transmission line 31 A, 31 B.

[0066] Alternatively, the layer parameters can be selected so that the first strip transmission line impedance is approximately the same as the second strip transmission line impedance. However, this design is best suited for loads with constant impedances.

[0067] With the present design, after the layer parameters are determined, the connector assembly 16 can be made using a process similar to that utilized to make a printed circuit board. As a non-exclusive example, (i) the first ground layer 22 and the first signal layer 26 can be laminated or printed onto opposite sides of the first insulation layer 24; and (ii) the second ground layer 30 can be laminated or printed onto the top of the second insulation layer 28. With this design, (i) the ground layers 22, 30 with the desired ground layer parameters can be easily and accurately made; and (ii) the signal layer 26 with the desired signal layer parameters can be easily and accurately made. Further, the connector assembly 16 is rigid and relatively durable.

[0068] Subsequently, the second insulation layer 28 can be stacked on top of the first signal layer 26 and a fastener assembly 36 can be used fixedly retain the insulation layers 24, 28 together.

[0069] The fastener assembly 36 can include one or more spaced apart fasteners, an adhesive or another type of way to fixedly secure these components together. In Figure 2A, for simplicity, the fastener assembly 36 is illustrated as only two bolts that extend through the insulation layers 24, 28. Alternatively, for example, the fastener assembly 36 can include more than two fasteners.

[0070] It should be noted that each insulation layer 24, 28 can be rigid and mechanically support the ground layers 22, 30 and the signal layer 26, which could otherwise be thin, brittle and subject to breaking. Further, the insulation layers 24, 28 electrically isolate the ground layers 22, 30 from the first signal layer 26. Moreover, the insulation layers 24, 28 electrically isolate the first signal layer 26 from neighboring components (not shown) to minimize interference that can change the capacitance and/or impedance of the connector assembly 16. This further inhibits distortion of the delivered pulsed signal 20.

[0071] Additionally, as provided above, the connector assembly 16 includes (i) the ground output connector 32 that electrically connects the ground layers 22, 30 to the electronic device 14; and (ii) the signal output connector 34 that electrically connects the ground layers 22, 30 to the electronic device 14. The design of each output connector 32, 34 can be varied. In the non-exclusive implementation of Figure 2A, each output connector 32, 34 includes three separate connection paths that provide a low impedance flow path. For example, each output connector 32, 34 can include an electrical connector (e.g. an electromechanical device with a plug and socket) that allows the connector assembly 16 to be selectively connected to and disconnected from the electronic device 14. However, other designs of the output connector 32, 34 are possible.

[0072] Further, in Figure 2A, the ground output connector 32 is connected between the ground layers 22, 30; extends through an opening in the first signal layer 26; and extends downward from the first ground layer 22. Moreover, the signal output connector 34 extends downward from the first signal layer 26, and extends through an opening in the first ground layer 22. In Figure 2A, the output connectors 32, 34 are oriented perpendicular to the planes of the layers 22, 24, 26, 28, 30. These output connectors 32, 34 can have other orientation as well. Alternatively, for example, one or both of the output connectors 32, 34 can extend through a side or top of the connector assembly 16.

[0073] As illustrated in Figure 2A, (i) the first ground layer 22 can include an input tab 22D that can be soldered to the pulse generator 12 (illustrated in Figure 1 ) to electrically connect the first ground layer 22 to the pulse generator 12; (ii) the first signal layer 26 can include an input tab 26D (illustrated in phantom) that can be soldered to the pulse generator 12 to electrically connect the first signal layer 26 to the pulse generator 12; and (iii) the second ground layer 30 can include an input tab 30D (illustrated in phantom) that can be soldered to the pulse generator 12 to electrically connect the second ground layer 26 to the pulse generator 12. Alternatively, these layers 22, 26, 30 can be electrically connected to the pulse generator 12 in another fashion.

[0074] Figure 3 is a simplified graph (pulse intensity versus time- unitless) that illustrates (i) an ideal generated pulsed signal 12A (represented with a solid line), (ii) a prior art, delivered pulsed signal 38 (represented with small dashes) that is transmitted with a prior art connector scheme (not shown), and (iii) a delivered pulsed signal 20 (illustrated with long dashes) that is transmitted using a connector assembly 16 having features of the present design. In this example, the ideal generated pulsed signal 12A is a rectangular shaped pulse. Further, the prior art, delivered pulsed signal 38 is significantly distorted, and has significant undershoot and overshoot that can damage the electronic device 14 and/or reduce the performance of the electronic device. In contrast, the delivered pulsed signal 20 with the present connector assembly 16 has less distortion, and very little (if any) overshoot. This can increase the life and performance of the electronic device14.

[0075] Figure 4 is a simplified perspective view of another implementation of the connector assembly 416 with the electronic device 414. In this implementation, the connector assembly 416 includes (i) a first ground layer 422, (ii) a first insulation layer 424, (iii) a first signal layer 426, (iv) a second insulation layer 428, (v) a second ground layer 430, (vi) a ground output connector 432, and (vii) a signal output connector 434 that are similar to the corresponding components described above and illustrated in Figure 2A.

[0076] However, in Figure 4, the connector assembly 416 also includes (i) a non- conductive third insulation layer 440 that is stacked on top of the second ground layer 430, and (ii) a second signal layer 442 stacked on top of the third insulation layer 440. In this embodiment, the third insulation layer 440 separates and rigidly connects the second signal layer 442 to the second ground layer 430. The third insulation layer 440 can be similar in design to the first and second insulation layers 424, 428, and the second signal layer 442 can be similar in design to the first signal layer 426.

[0077] In this implementation, (i) the first ground layer 422, the first insulation layer 424, and the first signal layer 426 cooperate to form a first strip transmission line having a first strip transmission line impedance; (ii) the second ground layer 430, the second insulation layer 428, and the first signal layer 426 cooperate to form a second strip transmission line having a second strip transmission line impedance; and (iii) the second ground layer 430, the third insulation layer 440 and the second signal layer 442 cooperate to form a third strip transmission line having a third strip transmission line impedance.

[0078] With this design, (i) one or more of the first ground layer parameters, the first insulation layer parameters, and/or one or more of the first signal layer parameters can be selected and adjusted to achieve a desired first strip transmission line impedance of the first strip transmission line; (ii) one or more of the second ground layer parameters, one or more of the second insulation layer parameters, and/or one or more of the first signal layer parameters can be selected and adjusted to achieve a desired second strip transmission line impedance of the second strip transmission line; and (iii) one or more of the second ground layer parameters, one or more of the third layer parameters, and/or one or more of the second signal layer parameters can be selected and adjusted to achieve a desired third strip transmission line impedance of the third strip transmission line. For example, the layer thicknesses, layer widths, or materals can be adjusted to achieve the desired strip transmission line impedances.

[0079] In one embodiment, these layer parameters are selected so that each strip transmission line impedance is different. As alternative, non-exclusive examples, the layer parameters (e.g. layer thicknesses) are selected so that (i) the first strip transmission line impedance is at least ten, fifteen, twenty, twenty-five, thirty, or thirty- five (5, 10, 15, 20, 25, 30 or 35) ohms different from the second strip transmission line impedance; (ii) the first strip transmission line impedance is at least ten, fifteen, twenty, twenty-five, thirty, or thirty-five (5, 10, 15, 20, 25, 30 or 35) ohms different from the third strip transmission line impedance; and (iii) the second strip transmission line impedance is at least ten, fifteen, twenty, twenty-five, thirty, or thirty-five (5, 10, 15, 20, 25, 30 or 35) ohms different from the third strip transmission line impedance. However, other values are possible.

[0080] As provided herein, having the appropriate different strip transmission line impedances can provide better delivered pulsed signal 20 for electronic devices 414 having variable impedance. Thus, the strip transmission line impedances can be determined and the layer parameters selected to provide a better, delivered pulsed signal 20. Stated in another fashion, a number of stacked, short, strip transmission lines that can interact with each other, inhibit distortion of the generated pulsed signal 12A for applications where the electronic device 414 has a variable impedance.

[0081] Figure 5 is a simplified cut-away view of yet another implementation of the connector assembly 516. In this implementation, the connector assembly 516 includes (i) a first ground layer 522, (ii) a first insulation layer 524, (iii) a first signal layer 526, (iv) a second insulation layer 528, (v) a second ground layer 530, (vi) a third insulation layer 540, and (vii) a second signal layer 542 that are similar to the corresponding components described above and illustrated in Figure 4.

[0082] However, in Figure 5, the connector assembly 416 also includes (i) a non- conductive fourth insulation layer 544 that is stacked on top of the second signal layer 542, and (ii) a third ground layer 546 stacked on top of the fourth insulation layer 544. In this embodiment, the fourth insulation layer 544 separates and rigidly connects the third ground layer 546 to the second signal layer 542. The fourth insulation layer 544 can be similar in design to the first, second and third insulation layers 524, 528, 540, and the third ground layer 546 can be similar in design to the first and second ground layers 522, 530.

[0083] In this implementation, (i) the first ground layer 522, the first insulation layer 524, and the first signal layer 526 cooperate to form a first strip transmission line having a first strip transmission line impedance; (ii) the second ground layer 530, the second insulation layer 528, and the first signal layer 526 cooperate to form a second strip transmission line having a second strip transmission line impedance; (iii) the second ground layer 530, the third insulation layer 540, and the second signal layer 542 cooperate to form a third strip transmission line having a third strip transmission line impedance; and (iv) the third ground layer 546, the fourth insulation layer 544, and the second signal layer 542 cooperate to form a fourth strip transmission line having a fourth strip transmission line impedance.

[0084] With this design, (i) one or more of the first ground layer parameters, one or more of the first insulation layer parameters, and/or one or more of the first signal layer parameters can be selected and adjusted to achieve a desired first strip transmission line impedance of the first strip transmission line; (ii) one or more of the second ground layer parameters, one or more of the second insulation layer parameters, and/or one or more of the first signal layer parameters can be selected and adjusted to achieve a desired second strip transmission line impedance of the second strip transmission line; (iii) one or more of the second ground layer parameters, one or more of the third insulation layer parameters, and/or one or more of the second signal layer parameters can be selected and adjusted to achieve a desired third strip transmission line impedance of the third strip transmission line; and (iv) one or more of the third ground layer parameters, one or more of the fourth insulation layer parameters, and/or one or more of the second signal layer parameters can be selected and adjusted to achieve a desired fourth strip transmission line impedance of the fourth strip transmission line. For example, the layer thicknesses, widths and/or materials can be adjusted to achieve the desired strip transmission line impedances.

[0085] In one embodiment, these layer parameters are selected so that each strip transmission line impedance is different to provide better delivered pulsed signals 20 for electronic devices having variable impedance.

[0086] Figure 6 is a simplified top view of another implementation of the connector assembly 616 having multiple layers 650 that cooperate to form two or more, short strip transmission lines. In this example, the multiple layers 650 can include one or more ground layers, insulators, and signal layers that are similar to the corresponding components described above. However, in Figure 6, each layer 650 has a trapezoidal shape. Alternatively, one or more of the layers 650 can have a configuration other than trapezoidal. For example, at least one of the layers 650 can be trapezoidal while at least one of the other layers has a different configuration. With this design, the shape of each layer 650 can be adjusted to achieve the desired strip transmission line impedance of each short strip transmission line.

[0087] Figure 7 is a simplified top view of another implementation of the connector assembly 716 having multiple layers 750 that cooperate to form two or more, short strip transmission lines. In this example, the multiple layers 750 can include one or more ground layers, insulators, and signal layers that are similar to the corresponding components described above. However, in Figure 7, each layer 750 has a zigzag shape. Alternatively, one or more of the layers 750 can have a configuration other than zigzag. For example, at least one of the layers 750 can be zigzag while at least one of the other layers has a different configuration. With this design, the shape of each layer 750 can be adjusted to achieve the desired strip transmission line impedance of each short strip transmission line.

[0088] Figure 8 is a simplified top view of another implementation of the connector assembly 816 having multiple layers 850 that cooperate to form two or more, short strip transmission lines. In this example, the multiple layers 850 can include one or more ground layers, insulators, and signal layers that are similar to the corresponding components described above. However, in Figure 8, each layer 850 has an angled shape (or another type of zigzag). Alternatively, one or more of the layers 850 can have a configuration other than angled. For example, at least one of the layers 850 can be angled while at least one of the other layers has a different configuration. With this design, the shape of each layer 850 can be adjusted to achieve the desired strip transmission line impedance of each short strip transmission line.

[0089] Figure 9 is a simplified top view of another implementation of the connector assembly 916 having multiple layers 950 that cooperate to form two or more, short strip transmission lines. In this example, the multiple layers 950 can include one or more ground layers, insulators, and signal layers that are similar to the corresponding components described above. However, in Figure 9, each layer 950 has an arc (sector) shape. In this design, for example, the input can be at the perimeter and output at the center. Alternatively, one or more of the layers 950 can have a configuration other than arc shaped. For example, at least one of the layers 950 can be arc shaped while at least one of the other layers has a different configuration. With this design, the shape of each layer 950 can be adjusted to achieve the desired strip transmission line impedance of each short strip transmission line.

[0090] Figure 10 is a simplified top view of another implementation of the connector assembly 1016 having multiple layers 1050 that cooperate to form two or more, short strip transmission lines. In this example, the multiple layers 1050 can include one or more ground layers, insulators, and signal layers that are similar to the corresponding components described above. However, in Figure 10, each layer 1050 has a semicircular (sector) shape. Alternatively, one or more of the layers 1050 can have a configuration other than semi-circular shape. For example, at least one of the layers 1050 can be semi-circular shape while at least one of the other layers has a different configuration. With this design, the shape of each layer 1050 can be adjusted to achieve the desired strip transmission line impedance of each short strip transmission line.

[0091] Figure 1 1 is a simplified top view of another implementation of the connector assembly 1116 having multiple layers 1150 that cooperate to form two or more, short strip transmission lines. In this example, the multiple layers 1 150 can include one or more ground layers, insulators, and signal layers that are similar to the corresponding components described above. However, in Figure 11 , each layer 1 150 has an annular circle shape. In this design, for example, the input can be at the perimeter and output at the center. Alternatively, one or more of the layers 1150 can have a configuration other than annular circle shape. For example, at least one of the layers 1150 can be annular circle shaped while at least one of the other layers has a different configuration. With this design, the shape of each layer 1150 can be adjusted to achieve the desired strip transmission line impedance of each short strip transmission line.

[0092] Figure 12 is a simplified top view of another implementation of the connector assembly 1216 having multiple layers 1250 that cooperate to form two or more, short strip transmission lines. In this example, the multiple layers 1250 can include one or more ground layers, insulators, and signal layers that are similar to the corresponding components described above. However, in Figure 12, each layer 1250 has a curve shape. In this design, for example, the input can be at the perimeter and output at the center. Alternatively, one or more of the layers 1250 can have a configuration other than curve shaped. For example, at least one of the layers 1250 can be curve shaped while at least one of the other layers has a different configuration. With this design, the shape of each layer 1250 can be adjusted to achieve the desired strip transmission line impedance of each short strip transmission line.

[0093] As provided herein, the short transmission lines can provide ultrashort (in duration) electrical pulses. For example, micro-electro-mechanical systems (“MEMS”) and very-large-scale integration (“VLSI”) technology can be used to produce the connectors. In one implementation, the connector assembly can be integrated with a portion of a gain medium grown thereon.

[0094] While the particular systems as shown and disclosed herein is fully capable of obtaining the objects and providing the advantages herein before stated, it is to be understood that it is merely illustrative of the presently preferred embodiments of the invention and that no limitations are intended to the details of construction or design herein shown other than as described in the appended claims.