SHOT BLASTING AND ELECTRODEPOSITION MANUFACTURING METHOD AND APPARATUS FOR THREE-DIMENSIONAL SURFACE

WIPO Patent Application WO/2018/006434

A1

Provided are a shot blasting and electrodeposition manufacturing method and apparatus for a three-dimensional surface. A deposition solution is mixed with a hard particle, and is then deposited, via blasting, onto a conductive substrate (2) to realize a rapid manufacturing technique for electrodeposition, reduce a crystal growth rate of an electrodeposition process, achieve the goal of fine crystal grain size, and significantly improve the quality of a deposited layer. Combining the two processes can effectively overcome defects of hydrogen generation at a cathode and loose texture, patches, and dents on the deposited layer as a result of contaminant adhesion, thereby improving hardness and compactness. A 5-axis interlocking numerical control processing system is incorporated to achieve processing in a three-dimensional space to improve the uniformity of the deposited layer and the precision of a shape. The method can be widely applied in the production of a precious metal item and a component with a complex shape, and can also be used for a rapid surface coating and strengthening technique.

JPS5848691

PLATING METHOD

ZHANG ZHAOYANG (CN)
DAI XUEREN (CN)
JIANG YUJIA (CN)
JIAO JIAN (CN)
CAO ZENGHUI (CN)
JIANG WEN (CN)
GU QINMING (CN)

PCT/CN2016/089856

January 11, 2018

July 13, 2016

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UNIV JIANGSU (CN)

C25D5/08; C25D15/00

US5865976A	1999-02-02
JPH08104997A	1996-04-23
CN105177639A	2015-12-23
CN102330126A	2012-01-25
CN101994137A	2011-03-30
JPH11350197A	1999-12-21

JW IP LAW FIRM (CN)

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