Title:
SIGNAL PROCESSING CHIP, IMAGE PROCESSING SYSTEM AND DISTANCE MEASUREMENT SYSTEM
Document Type and Number:
WIPO Patent Application WO/2019/041257
Kind Code:
A1
Abstract:
Provided are a signal processing chip, an image processing system and a distance measurement system. The signal processing chip comprises: a first photoelectric sensor array configured to receive an optical signal and convert the optical signal into a first electrical signal; and a first CMOS readout circuit, wherein the first CMOS readout circuit is configured to receive the first electrical signal, and process the first electrical signal so as to obtain time data for indicating the time of flight of the optical signal. The first photoelectric sensor array is a silicon-based photoelectric sensor array, and the first photoelectric sensor array and the first CMOS readout circuit are integrated on the same silicon wafer. A photoelectric sensor array is used to receive an optical signal, so that the complexity of a distance measurement system can be reduced, and the reliability of the distance measurement system is improved.
Inventors:
ZHENG GUOGUANG (CN)
HONG XIAOPING (CN)
WANG MINGYU (CN)
HONG XIAOPING (CN)
WANG MINGYU (CN)
Application Number:
PCT/CN2017/099998
Publication Date:
March 07, 2019
Filing Date:
August 31, 2017
Export Citation:
Assignee:
SZ DJI TECHNOLOGY CO LTD (CN)
International Classes:
G01S17/08; G01S7/4912
Foreign References:
| CN104505394A | 2015-04-08 | |||
| CN107024696A | 2017-08-08 | |||
| CN103839951A | 2014-06-04 |
Attorney, Agent or Firm:
LONGSUN LEAD IP LTD. (CN)
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