Title:
SILICON CONDENSER MICROPHONE HAVING AN ADDITIONAL BACK CHAMBER AND A FABRICATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2011/049276
Kind Code:
A1
Abstract:
The present invention relates to a fabrication method of a silicon condenser microphone having an additional back chamber. The method of the present invention comprises: applying an adhesive to a substrate and then mounting a chamber casing; curing the adhesive used for adhering the chamber casing; applying an adhesive onto the chamber casing and then mounting a MEMS chip with a mounter; curing the adhesive used for adhering the MEMS chip; and joining the casing and the substrate mounted with components. As the back chamber formed by the chamber casing is added to the back chamber of the MEMS chip, an additional back chamber is provided. Therefore, the silicon condenser microphone fabricated according to the present invention can improve sensitivity by increasing the small back chamber space of the MEMS chip itself and reduce noise including THD (Total Harmonic Distortion).
Inventors:
SONG CHUNG-DAM (KR)
Application Number:
PCT/KR2010/000873
Publication Date:
April 28, 2011
Filing Date:
February 11, 2010
Export Citation:
Assignee:
BSE CO LTD (KR)
SONG CHUNG-DAM (KR)
SONG CHUNG-DAM (KR)
International Classes:
H04R19/04; H04R31/00
Foreign References:
| KR100722689B1 | 2007-05-30 | |||
| KR100904285B1 | 2009-06-25 | |||
| KR100675022B1 | 2007-01-29 | |||
| KR100675023B1 | 2007-01-30 |
Other References:
See also references of EP 2493214A4
None
None
Attorney, Agent or Firm:
YOON, Byung-Sam et al. (KR)
윤병삼 (KR)
윤병삼 (KR)
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