Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SILICON-CONTAINING POLYMER, PROCESS FOR RPODUCING THE SAME, HEAT-RESISTANT RESIN COMPOSITION, AND HEAT-RESISTANT FILM
Document Type and Number:
WIPO Patent Application WO/2005/010077
Kind Code:
A1
Abstract:
An alkali-soluble silicon-containing polymer which is represented by the following formula and has a weight-average molecular weight of 500 to 500,000. (I) In the formula, A1 is phenyl having hydroxy or alkoxy; R1 is C1-4 alkylene; m is 0 or 1; R2 is C1-4 alkyl; and s and u each is a positive number and t is 0 or a positive number, provided that 0≤t/(s+u)≤1 and 0

Inventors:
TAUCHI KUNIKAZU (JP)
SUZUKI HIROSHI (JP)
Application Number:
PCT/JP2004/010853
Publication Date:
February 03, 2005
Filing Date:
July 29, 2004
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TOAGOSEI CO LTD (JP)
TAUCHI KUNIKAZU (JP)
SUZUKI HIROSHI (JP)
International Classes:
C08G77/14; C08G77/16; C08G77/18; C08G77/20; C09D183/06; G03F7/075; H01L21/312; (IPC1-7): C08G77/14; C08G77/20; G03F7/075
Foreign References:
JPH08245792A1996-09-24
JP2001288267A2001-10-16
JPH06128378A1994-05-10
US6596404B12003-07-22
JPH05323612A1993-12-07
JPH01123229A1989-05-16
JPH04184444A1992-07-01
JPH01292036A1989-11-24
JPH09249749A1997-09-22
JP2003255546A2003-09-10
JP2004161867A2004-06-10
JPH06148895A1994-05-27
Other References:
See also references of EP 1650250A4
Attorney, Agent or Firm:
Kojima, Seiji (7-26 Jingu 3-chome, Atsuta-k, Nagoya-shi Aichi 31, JP)
Download PDF: