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Title:
SILICON ROD CUTTING DEVICE AND SILICON ROD CUTTING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/105162
Kind Code:
A1
Abstract:
A silicon rod cutting device and a silicon rod cutting method, the silicon rod cutting device comprising a machine base (11), a material conveying platform (12) and at least two wire cutting apparatuses, the at least two wire cutting apparatuses are independent from one another, and thus silicon rods carried on the material conveying platform (12) may be cut by means of the independent wire cutting apparatus, which improves the freedom of operation and cutting efficiency in a silicon rod cutting operation. A wire cutting unit in the wire cutting apparatus is provided with a closed-loop cutting wire (164), and therefore a cutting wire operating at high speed may be maintained, improving cutting efficiency. Meanwhile, the closed-loop cutting wire (164) can operate in the same operating direction during a cutting operation, as such, the wire cutting unit may achieve a high-precision cutting operation, thus avoiding problems in existing cutting methods such as ripples being present on a cutting surface caused by a change in direction or operation speed of the operating of the cutting wire. Meanwhile, the closed-loop cutting wire (164) may effectively reduce the total length of cutting wire required by the wire cutting unit and eliminate components such as take-up and pay-off reels, reducing production costs.

Inventors:
LU JIANWEI (CN)
JIN YETIAN (CN)
PAN XUEMING (CN)
ZHU QINCHAO (CN)
Application Number:
PCT/CN2021/094823
Publication Date:
May 27, 2022
Filing Date:
May 20, 2021
Export Citation:
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Assignee:
TDG NISSIN PREC MACHINERY CO LTD (CN)
International Classes:
B28D5/04
Foreign References:
CN109773993A2019-05-21
CN210256791U2020-04-07
CN110948719A2020-04-03
CN201857361U2011-06-08
CN108162220A2018-06-15
CN208645714U2019-03-26
CN110303608A2019-10-08
JPH02500577A1990-03-01
Attorney, Agent or Firm:
SHANGHAI DIANSHI PARTNERS, P.C. (CN)
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