Title:
SILICONE ADDITIVE FOR RESIN MODIFICATION AND CURABLE RESIN COMPOSITION CONTAINING SAME
Document Type and Number:
WIPO Patent Application WO/2023/079959
Kind Code:
A1
Abstract:
The present invention provides: a silicone additive for resin modification characterized by containing a maleimide-group-containing organopolysiloxane (I) represented by general formula (1) (in the formula, each R1 independently represents a C1-12 monovalent hydrocarbon group, 50 mol% or more of all R1 are methyl groups, each R2 independently represents a hydrogen atom or a C1-5 monovalent hydrocarbon group, and n represents an integer of 4-20) and an acetoxysuccinimide-group-containing organopolysiloxane (II) represented by general formula (2) (in the formula, R1, R2, and n are the same as above), and characterized in that the component (II) content is 0-20 mol% relative to a total of 100 mol% of the components (I) and (II); and a curable resin composition containing the silicone additive for resin modification. Exceptional flexibility, heat resistance, and dielectric properties can be imparted by using the silicone additive for resin modification according to the present invention in a curable resin composition.
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Inventors:
FUJITA SHOJI (JP)
Application Number:
PCT/JP2022/038957
Publication Date:
May 11, 2023
Filing Date:
October 19, 2022
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08L101/00; C07F7/10; C08G73/00; C08G77/26; C08G77/388; C08K5/315; C08K5/3415; C08L83/08; C09K3/00
Domestic Patent References:
| WO2017145668A1 | 2017-08-31 |
Foreign References:
| JPH05320348A | 1993-12-03 | |||
| JP2017149871A | 2017-08-31 |
Attorney, Agent or Firm:
PATENT ATTORNEY CORPORATION EI-MEI PATENT OFFICE (JP)
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