Title:
SILICONE ADHESIVE COMPOSITION AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2022/138345
Kind Code:
A1
Abstract:
[Problem] To provide: a composition that, even when the contained amount of a solvent is low, has viscosity allowing the composition to be applicable, that has excellent curability, and that provides a Si-based pressure-sensitive adhesive which is formed by a curing reaction and which has a low glass transition point (Tg), good wettability, good mechanical strength, and good elongation irrespective of having high adhesive strength and tackiness; and use of the composition. [Solution] A low-solvent/solvent-free silicone adhesive composition comprising: (A) a chain organopolysiloxane having an aliphatic unsaturated carbon-carbon bond-containing group only at an end or ends of the molecular chain; (B) a straight-chain organohydrogenpolysiloxane having Si-H only at both ends thereof; (C) an organopolysiloxane resin having a weight-average molecular weight of less than 5000; (D) an organopolysiloxane having three or more aliphatic unsaturated carbon-carbon bond-containing groups in the molecule, and having one or more of said groups at a site other than the ends thereof; and (E) a hydrosilylation reaction catalyst, wherein the glass transition point (Tg) of the pressure-sensitive adhesive layer is 50°C or lower. Use of the composition.
Inventors:
ONODERA SATOSHI (JP)
NIKI HARUMI (JP)
IIMURA TOMOHIRO (JP)
NIKI HARUMI (JP)
IIMURA TOMOHIRO (JP)
Application Number:
PCT/JP2021/046138
Publication Date:
June 30, 2022
Filing Date:
December 14, 2021
Export Citation:
Assignee:
DOW TORAY CO LTD (JP)
International Classes:
B05D7/24; B32B7/12; B32B27/00; C09J7/38; C09J11/06; C09J183/05; C09J183/07
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