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Title:
SILICONE-BASED POLYMER COMPOUND AND SILICONE-BASED POLYMER MATERIAL
Document Type and Number:
WIPO Patent Application WO/2023/003043
Kind Code:
A1
Abstract:
Provided are a novel silicone-based polymer compound excelling in a mechanical property, and a silicone-based polymer material including the silicone-based polymer compound. The silicone-based polymer compound of the present invention is a silicone-based polymer compound (H) having a polysiloxane skeleton as a main chain, wherein the polysiloxane skeleton has at least one host group in a side chain, and the host group is a monovalent group wherein one hydrogen atom or hydroxyl group is removed from cyclodextrin or a cyclodextrin derivative.

Inventors:
TAKASHIMA YOSHINORI (JP)
HARADA AKIRA (JP)
OSAKI MOTOFUMI (JP)
PARK JUNSU (JP)
YOSHIDA DAICHI (JP)
NAKAGAWA HIDEO (JP)
IGARASHI MINORU (JP)
KATO NOBU (JP)
KAMEI MASANAO (JP)
OGURA KENTARO (JP)
Application Number:
PCT/JP2022/028405
Publication Date:
January 26, 2023
Filing Date:
July 21, 2022
Export Citation:
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Assignee:
UNIV OSAKA (JP)
SHINETSU CHEMICAL CO (JP)
International Classes:
C08G77/392; C08K5/01; C08L83/04
Domestic Patent References:
WO2021045203A12021-03-11
WO2020139403A12020-07-02
WO2018159791A12018-09-07
WO2021045203A12021-03-11
Foreign References:
JP2005536653A2005-12-02
JP2000506554A2000-05-30
JP2014047269A2014-03-17
US6316268B12001-11-13
Other References:
KNUDSEN BERIT, KERGL BEATE E., PAULSEN HELENE, DURNEV VALERIJ, RITTER HELMUT: "Noncovalent linkage of telechelic oligo(dimethylsiloxanes) via end group attachment of host‐cyclodextrins and guest‐adamantanes or guest‐ferrocenes", JOURNAL OF POLYMER SCIENCE PART A: POLYMER CHEMISTRY, JOHN WILEY & SONS, INC., US, vol. 51, no. 11, 1 June 2013 (2013-06-01), US , pages 2472 - 2482, XP055850561, ISSN: 0887-624X, DOI: 10.1002/pola.26636
NOOMEN, A. ; HBAIEB, S. ; PARROT-LOPEZ, H. ; KALFAT, R. ; FESSI, H. ; AMDOUNI, N. ; CHEVALIER, Y.: "Emulsions of beta-cyclodextrins grafted to silicone for the transport of antifungal drugs", MATERIALS SCIENCE AND ENGINEERING C, ELSEVIER SCIENCE S.A., CH, vol. 28, no. 5-6, 1 July 2008 (2008-07-01), CH , pages 705 - 715, XP022627283, ISSN: 0928-4931, DOI: 10.1016/j.msec.2007.10.057
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
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