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Title:
SILICONE CHAIN-CONTAINING POLYMER, METHOD FOR PRODUCING SILICONE CHAIN-CONTAINING POLYMER, COATING COMPOSITION, RESIST COMPOSITION, AND ARTICLE
Document Type and Number:
WIPO Patent Application WO/2023/140036
Kind Code:
A1
Abstract:
Provided is a silicone chain-containing polymer that functions as a leveling agent which is able to achieve high smoothness and suppress pin unevenness, with respect to a coating film. Specifically, provided is a silicone chain-containing polymer which contains, as polymer components: a polymerizable monomer (1) having a group that contains a structure represented by general formula (A); and a polymerizable monomer (2) having at least one group selected from among alkyl groups having 1-18 carbon atoms, aromatic groups having 6-18 carbon atoms and groups containing a polyoxyalkylene chain. The proportion of the polymerizable monomer (1) is 20 wt% or less of the polymer components. The weight average molecular weight of the polymer is 15,000 or more.

Inventors:
UENO JUNPEI (JP)
HATASE MASAKI (JP)
NOGUCHI JUN (JP)
SHIMIZU RYOHEI (JP)
NOGUCHI YUUKI (JP)
SASAMOTO SHIN (JP)
SUZUKI HIDEYA (JP)
Application Number:
PCT/JP2022/047259
Publication Date:
July 27, 2023
Filing Date:
December 22, 2022
Export Citation:
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Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08F220/26; C09D133/04; C09D201/06; G02B5/20; G03F7/004
Domestic Patent References:
WO2022059492A12022-03-24
WO2022130990A12022-06-23
WO2022244586A12022-11-24
Foreign References:
JP2018199765A2018-12-20
JP2017227883A2017-12-28
JP2001353817A2001-12-25
JP2010085606A2010-04-15
JP2008001896A2008-01-10
Attorney, Agent or Firm:
ONO Takayuki (JP)
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