Title:
SILICONE COMPOSITION FOR FORMING PEELABLE CURED FILM, AND RELEASE SHEET
Document Type and Number:
WIPO Patent Application WO/2022/250125
Kind Code:
A1
Abstract:
The present invention relates to a silicone composition for forming a peelable cured film, said silicone composition comprising: (A) a chain organopolysiloxane that has a viscosity greater than 100,000 mPa∙s at 25°C, and has at least two C2-12 alkenyl groups per molecule, but only in a side chain of the molecule; (B) a chain organopolysiloxane that has a viscosity of 1,000-100,000 mPa∙s at 25°C, has at least two C2-12 alkenyl groups within one molecule, but only in a side chain of the molecule, and has an alkenyl group content of 0.0018-0.0148 mol/100 g; (C) an organopolysiloxane that has at least two silicon-bonded hydrogen atoms within one molecule; and (D) a catalyst for a hydrosilylation reaction. This composition is capable of forming a peelable cured film that demonstrates a relatively light peeling resistance with regard to an adhesive substance, said peeling resistance changing little over time, and furthermore suppresses a reduction in the residual adhesion ratio of said adhesive substance.
Inventors:
ENDO SYUJI (JP)
HINO TAKAKAZU (JP)
HINO TAKAKAZU (JP)
Application Number:
PCT/JP2022/021671
Publication Date:
December 01, 2022
Filing Date:
May 27, 2022
Export Citation:
Assignee:
DOW TORAY CO LTD (JP)
International Classes:
C08L83/05; C08L83/07; C09D7/63; C09D183/04; C09D183/05; C09D183/07; C09K3/00
Domestic Patent References:
| WO2021132515A1 | 2021-07-01 |
Foreign References:
| JP2009114403A | 2009-05-28 | |||
| JP2004190202A | 2004-07-08 | |||
| JPH07258606A | 1995-10-09 | |||
| JPS61159480A | 1986-07-19 |
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