Title:
SILICONE EXHIBITING HOT-MELT PROPERTIES, AND CURABLE HOT-MELT COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2015/194158
Kind Code:
A1
Abstract:
Provided is a silicone exhibiting hot-melt properties which is obtained by inducing, in the presence of a hydrosilylation reaction catalyst (C), a hydrosilylation reaction between an alkenyl-group-containing organopolysiloxane (A) in which phenyl groups account for at least 10 mol% of all silicon-bonded organic groups, and an organopolysiloxane (B) including at least two silicon-bonded hydrogen atoms per molecule. The silicone exhibiting hot-melt properties is not a liquid at 25˚C, and has a melt viscosity at 100˚C of not more than 5,000 Pa∙s. Also provided is a curable hot-melt composition which comprises at least: the silicone (I) exhibiting hot-melt properties; an organopolysiloxane (II) which includes at least two silicon-bonded hydrogen atoms per molecule, and which includes at least 0.5 mass% of silicon-bonded hydrogen atoms; and a hydrosilylation reaction catalyst (III). The silicone exhibiting hot-melt properties is not a liquid at 25˚C, has low surface tack, and is easily melted by being heated. Furthermore, the curable hot-melt composition exhibits both curability and hot-melt properties.
Inventors:
YAMAZAKI HARUNA (JP)
YOSHITAKE MAKOTO (JP)
YAMAZAKI RYOSUKE (JP)
YOSHITAKE MAKOTO (JP)
YAMAZAKI RYOSUKE (JP)
Application Number:
PCT/JP2015/002990
Publication Date:
December 23, 2015
Filing Date:
June 16, 2015
Export Citation:
Assignee:
DOW CORNING TORAY CO LTD (JP)
International Classes:
C08G77/50; C08G77/44; C08L83/05; C08L83/14; C09J11/00; C09J183/05; C09J183/07
Foreign References:
| JP2013001794A | 2013-01-07 | |||
| JP2013076050A | 2013-04-25 | |||
| JP2003253122A | 2003-09-10 | |||
| JPH0586351A | 1993-04-06 |
Other References:
See also references of EP 3159369A4
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